Material assisted laser ablation

Junghun Chae (Inventor), Kanti Jain (Inventor)

Research output: Patent

Abstract

This invention provides photoablation—based processing techniques and materials strategies for making, assembling and integrating patterns of materials for the fabrication of electronic, optical and opto-electronic devices. Processing techniques of the present invention enable high resolution and/or large area patterning and integration of porous and/or nano- or micro-structured materials comprising active or passive components of a range of electronic devices, including integrated circuits (IC), microelectronic and macroelectronic systems, microfluidic devices, biomedical devices, sensing devices and device arrays, and nano- and microelectromechanical systems.
Original languageEnglish (US)
U.S. patent number8546067
Filing date3/21/08
StatePublished - Oct 1 2013

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