Master creep compliance curve for random viscoelastic material properties

Jutima Simsiriwong, Rani W. Sullivan, Harry H. Hilton

Research output: Chapter in Book/Report/Conference proceedingConference contribution


The objective of this study is to apply the time-temperature superposition principle (TTSP) to the viscoelastic material functions that exhibit a large degree of variability to predict the long-term behavior of a vinyl ester polymer (Derakane 441-400). Short-term tensile creep experiments were conducted at three temperatures below the glass transition temperature. Strain measurements in the longitudinal and transverse directions were measured simultaneously using the digital image correlation technique. The creep compliance functions were characterized using the generalized viscoelastic constitutive equation with a Prony series representation. The Weibull probability density functions (PDFs) of the creep compliance functions were obtained for each test configuration and found to be time and temperature dependent. Creep compliance curves at constant probabilities were obtained and used to develop the master curves for a reference temperature of 24°C using the TTSP.

Original languageEnglish (US)
Title of host publicationChallenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials - Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics
Number of pages7
StatePublished - 2014
Event2013 Annual Conference on Experimental and Applied Mechanics - Lombard, IL, United States
Duration: Jun 3 2013Jun 5 2013

Publication series

NameConference Proceedings of the Society for Experimental Mechanics Series
ISSN (Print)2191-5644
ISSN (Electronic)2191-5652


Other2013 Annual Conference on Experimental and Applied Mechanics
Country/TerritoryUnited States
CityLombard, IL


  • Creep compliance
  • Prony series
  • Time-temperature superposition principle (TTSP)
  • Vinyl ester polymer
  • Weibull probability distribution

ASJC Scopus subject areas

  • Engineering(all)
  • Computational Mechanics
  • Mechanical Engineering


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