Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

Keyphrases

• Equivalent Thermal Conductivity 100%
• Geometric Parameters 33%
• Good Accuracy 33%
• Heat Flow 33%
• Heat Source 33%
• Lateral Angle 33%
• Material Parameters 33%
• Modified Nodal Analysis 33%
• Multiple Directions 33%
• Numerical Validation 33%
• Simulation Time 33%
• Spatial Distribution 33%
• Temperature Distribution 33%
• Thermal Capacitance 33%
• Thermal Network 33%
• Thermal Resistance 33%
• Three-dimensional (3D) 33%
• Through Silicon via 100%
• Transient Thermal Analysis 100%
• Transient Variation 33%
• Via Arrays 100%

Engineering

• Actuator 50%
• Circuit Model 100%
• Good Accuracy 50%
• Heat Resistance 50%
• Heat Source 50%
• Heat Transfer 50%
• Lateral Direction 50%
• Material Parameter 50%
• Nodal Analysis 50%
• Simulation Time 50%
• Spatial Distribution 50%
• Thermal Capacitance 50%