Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

Keyphrases

• Through Silicon via 100%
• Transient Thermal Analysis 100%
• Via Arrays 100%
• Equivalent Thermal Conductivity 100%
• Three-dimensional (3D) 33%
• Temperature Distribution 33%
• Spatial Distribution 33%
• Heat Flow 33%
• Simulation Time 33%
• Thermal Resistance 33%
• Material Parameters 33%
• Heat Source 33%
• Good Accuracy 33%
• Lateral Angle 33%
• Geometric Parameters 33%
• Numerical Validation 33%
• Multiple Directions 33%
• Modified Nodal Analysis 33%
• Transient Variation 33%
• Thermal Network 33%
• Thermal Capacitance 33%

Engineering

• Transients 100%
• Circuit Model 100%
• Material Parameter 33%
• Good Accuracy 33%
• Simulation Time 33%
• Lateral Direction 33%
• Nodal Analysis 33%
• Thermal Capacitance 33%
• Spatial Distribution 33%
• Actuator 33%
• Heat Resistance 33%
• Heat Source 33%