Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

Qiu Min, Er Ping Li, Jianming Jin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a lumped three-dimensional equivalent thermal circuit model for the transient thermal analysis of through silicon via (TSV) arrays. The distribution of heat source and the multiple directions of heat flow are both included. Thermal network is built up for TSV arrays with thermal resistances and capacitances analytically calculated from geometry and material parameters. With simulation conducted using a commonly-used modified nodal analysis solver, the transient variation and spatial distribution of temperature in both vertical and lateral directions can be captured. Numerical validations demonstrate that the proposed model greatly reduces simulation time while maintaining a good accuracy.

Original languageEnglish (US)
Title of host publication2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538671115
DOIs
StatePublished - Mar 2019
Event5th IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Shanghai, China
Duration: Mar 20 2019Mar 22 2019

Publication series

Name2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings

Conference

Conference5th IEEE International Conference on Computational Electromagnetics, ICCEM 2019
CountryChina
CityShanghai
Period3/20/193/22/19

Fingerprint

Transient Analysis
Thermal Analysis
Thermoanalysis
3D
Silicon
thermal analysis
Thermal Resistance
Networks (circuits)
Heat Flow
Heat Source
silicon
thermal resistance
Capacitance
heat sources
Spatial Distribution
heat transmission
Lateral
spatial distribution
Simulation
simulation

Keywords

  • equivalent circuit model
  • three-dimensional thermal network
  • through silicon via
  • transient thermal analysis

ASJC Scopus subject areas

  • Computational Mathematics
  • Electrical and Electronic Engineering
  • Instrumentation
  • Radiation

Cite this

Min, Q., Li, E. P., & Jin, J. (2019). Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array. In 2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings [8779007] (2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/COMPEM.2019.8779007

Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array. / Min, Qiu; Li, Er Ping; Jin, Jianming.

2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8779007 (2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Min, Q, Li, EP & Jin, J 2019, Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array. in 2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings., 8779007, 2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 5th IEEE International Conference on Computational Electromagnetics, ICCEM 2019, Shanghai, China, 3/20/19. https://doi.org/10.1109/COMPEM.2019.8779007
Min Q, Li EP, Jin J. Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array. In 2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8779007. (2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings). https://doi.org/10.1109/COMPEM.2019.8779007
Min, Qiu ; Li, Er Ping ; Jin, Jianming. / Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array. 2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. (2019 IEEE International Conference on Computational Electromagnetics, ICCEM 2019 - Proceedings).
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abstract = "This paper presents a lumped three-dimensional equivalent thermal circuit model for the transient thermal analysis of through silicon via (TSV) arrays. The distribution of heat source and the multiple directions of heat flow are both included. Thermal network is built up for TSV arrays with thermal resistances and capacitances analytically calculated from geometry and material parameters. With simulation conducted using a commonly-used modified nodal analysis solver, the transient variation and spatial distribution of temperature in both vertical and lateral directions can be captured. Numerical validations demonstrate that the proposed model greatly reduces simulation time while maintaining a good accuracy.",
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