Low cycle fatigue behavior of Sn-3.8Ag-0.7Cu lead-free solder

Qiulian Zeng, Zhongguang Wang, Aiping Xian, Jianku Shang

Research output: Contribution to journalArticlepeer-review


Low cycle fatigue tests of Sn-3.8Ag-0.7Cu lead-free solder alloy were carried out under total strain amplitude control at room temperature. The fatigue behavior of the solder alloy was characterized by the cyclic stress-strain hysteresis loops, cyclic stress responses, cyclic stress-strain curves, and the relationship between strain and fatigue life. At higher strain amplitudes (1%), the solder alloy exhibited cycle-dependent softening. At lower strain amplitudes (≤0.4%), stable cyclic response was observed over a significant portion of the fatigue life. The fatigue life of the solder alloy followed the Coffin-Manson equation, from which relevant fatigue parameters were determined. The fatigue behavior of the solder alloy was related to the fatigue-induced microstructural variations and the fracture mechanism.

Original languageEnglish (US)
Pages (from-to)11-17
Number of pages7
JournalCailiao Yanjiu Xuebao/Chinese Journal of Materials Research
Issue number1
StatePublished - Feb 2004


  • Cycle-dependent softening
  • Lead-free solder
  • Low-cycle fatigue
  • Mechanical properties
  • Metallic materials
  • Sn alloy

ASJC Scopus subject areas

  • Materials Science(all)


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