Lithium niobate MEMS chirp compressors for near Zero power wake-up radios

Tomás Manzaneque, Ruochen Lu, Yansong Yang, Songbin Gong

Research output: Contribution to journalArticlepeer-review

Abstract

This paper presents the first demonstration of chirp compressors based on laterally vibrating modes in suspended lithium niobate thin films. Both shear-horizontal and length-extensional modes have been explored and demonstrated with the electromechanical coupling coefficients of 30% and 39%, respectively, in a double-dispersive delay line structure. The high electromechanical coupling, along with the low propagation loss in the suspended thin film, produces a low insertion loss of 10 dB over a large fractional bandwidth of 50%. The best fabricated device demonstrates a delay-bandwidth product of 100, and provides a voltage gain of 5 to the corresponding chirp signals. Moreover, significant signal-to-noise ratio enhancements (>100), collectively enabled by the processing gain and filtering characteristics of the chirp compressors, have been demonstrated. The measured devices, in this paper, greatly outperform state-of-the-art chirp compressors based on surface acoustic waves in insertion loss for a comparable TB. As a result, signal-to-noise ratio enhancement and voltage gain have been simultaneously demonstrated for the first time in a passive device and the analog domain. The high performance can be harnessed to greatly enhance the sensitivity of near zero power wake-up radio receivers and enable low-power wireless connectivity for Internet of Things applications.

Original languageEnglish (US)
Pages (from-to)1204-1215
Number of pages12
JournalJournal of Microelectromechanical Systems
Volume26
Issue number6
DOIs
StatePublished - Dec 2017

Keywords

  • Acoustic devices
  • Chirp compressors
  • Delay lines
  • Internet of things
  • Lithium niobate
  • Low power devices
  • Microelectromechanical systems
  • Piezoelectricity
  • Wake-up radios

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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