Linear time algorithm to find all relocation positions for EUV defect mitigation

Yuelin Du, Hongbo Zhang, Qiang Ma, Martin D F Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to the absence of defect-free blanks in extreme ultraviolet (EUV) lithography, defect mitigation is necessary before mass production. One effective defect mitigation approach is to cover defects by device features, such that the defects will no longer be printable. Normally die size is much smaller than the exposure field on the blank, such that one blank can accommodate multiple copies of a die, each of which can be placed independently within the exposure field. For thorough utilization of blank area, the number of valid dies that are not impacted by any defects should be maximized. To do so, all relocation positions to place a single valid die on a defective blank must be determined first [1]. To the best of our knowledge, no existing work can find all relocation positions throughout the whole blank in a reasonable amount of time. In this paper, we develop an efficient algorithm to solve this problem. The time complexity of our algorithm is linear in the number of features in the die. Experimental results with full die layouts generated from a standard cell library validate the efficiency of our algorithm. Comparing to the algorithm in [2] which runs more than one week without termination, our algorithm only takes several hours to find all relocation positions for a die with millions of features.

Original languageEnglish (US)
Title of host publication2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Pages261-266
Number of pages6
DOIs
StatePublished - May 20 2013
Event2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 - Yokohama, Japan
Duration: Jan 22 2013Jan 25 2013

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
CountryJapan
CityYokohama
Period1/22/131/25/13

Fingerprint

Relocation
Defects
Extreme ultraviolet lithography

Keywords

  • Blank Defect Mitigation
  • EUV
  • Linear Time
  • Multi-die Placement
  • Relocation Positions

ASJC Scopus subject areas

  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

Cite this

Du, Y., Zhang, H., Ma, Q., & Wong, M. D. F. (2013). Linear time algorithm to find all relocation positions for EUV defect mitigation. In 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 (pp. 261-266). [6509606] (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2013.6509606

Linear time algorithm to find all relocation positions for EUV defect mitigation. / Du, Yuelin; Zhang, Hongbo; Ma, Qiang; Wong, Martin D F.

2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013. 2013. p. 261-266 6509606 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Du, Y, Zhang, H, Ma, Q & Wong, MDF 2013, Linear time algorithm to find all relocation positions for EUV defect mitigation. in 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013., 6509606, Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, pp. 261-266, 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, 1/22/13. https://doi.org/10.1109/ASPDAC.2013.6509606
Du Y, Zhang H, Ma Q, Wong MDF. Linear time algorithm to find all relocation positions for EUV defect mitigation. In 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013. 2013. p. 261-266. 6509606. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2013.6509606
Du, Yuelin ; Zhang, Hongbo ; Ma, Qiang ; Wong, Martin D F. / Linear time algorithm to find all relocation positions for EUV defect mitigation. 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013. 2013. pp. 261-266 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).
@inproceedings{109c61f4e1ed471dae8f4fc68d795020,
title = "Linear time algorithm to find all relocation positions for EUV defect mitigation",
abstract = "Due to the absence of defect-free blanks in extreme ultraviolet (EUV) lithography, defect mitigation is necessary before mass production. One effective defect mitigation approach is to cover defects by device features, such that the defects will no longer be printable. Normally die size is much smaller than the exposure field on the blank, such that one blank can accommodate multiple copies of a die, each of which can be placed independently within the exposure field. For thorough utilization of blank area, the number of valid dies that are not impacted by any defects should be maximized. To do so, all relocation positions to place a single valid die on a defective blank must be determined first [1]. To the best of our knowledge, no existing work can find all relocation positions throughout the whole blank in a reasonable amount of time. In this paper, we develop an efficient algorithm to solve this problem. The time complexity of our algorithm is linear in the number of features in the die. Experimental results with full die layouts generated from a standard cell library validate the efficiency of our algorithm. Comparing to the algorithm in [2] which runs more than one week without termination, our algorithm only takes several hours to find all relocation positions for a die with millions of features.",
keywords = "Blank Defect Mitigation, EUV, Linear Time, Multi-die Placement, Relocation Positions",
author = "Yuelin Du and Hongbo Zhang and Qiang Ma and Wong, {Martin D F}",
year = "2013",
month = "5",
day = "20",
doi = "10.1109/ASPDAC.2013.6509606",
language = "English (US)",
isbn = "9781467330299",
series = "Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC",
pages = "261--266",
booktitle = "2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013",

}

TY - GEN

T1 - Linear time algorithm to find all relocation positions for EUV defect mitigation

AU - Du, Yuelin

AU - Zhang, Hongbo

AU - Ma, Qiang

AU - Wong, Martin D F

PY - 2013/5/20

Y1 - 2013/5/20

N2 - Due to the absence of defect-free blanks in extreme ultraviolet (EUV) lithography, defect mitigation is necessary before mass production. One effective defect mitigation approach is to cover defects by device features, such that the defects will no longer be printable. Normally die size is much smaller than the exposure field on the blank, such that one blank can accommodate multiple copies of a die, each of which can be placed independently within the exposure field. For thorough utilization of blank area, the number of valid dies that are not impacted by any defects should be maximized. To do so, all relocation positions to place a single valid die on a defective blank must be determined first [1]. To the best of our knowledge, no existing work can find all relocation positions throughout the whole blank in a reasonable amount of time. In this paper, we develop an efficient algorithm to solve this problem. The time complexity of our algorithm is linear in the number of features in the die. Experimental results with full die layouts generated from a standard cell library validate the efficiency of our algorithm. Comparing to the algorithm in [2] which runs more than one week without termination, our algorithm only takes several hours to find all relocation positions for a die with millions of features.

AB - Due to the absence of defect-free blanks in extreme ultraviolet (EUV) lithography, defect mitigation is necessary before mass production. One effective defect mitigation approach is to cover defects by device features, such that the defects will no longer be printable. Normally die size is much smaller than the exposure field on the blank, such that one blank can accommodate multiple copies of a die, each of which can be placed independently within the exposure field. For thorough utilization of blank area, the number of valid dies that are not impacted by any defects should be maximized. To do so, all relocation positions to place a single valid die on a defective blank must be determined first [1]. To the best of our knowledge, no existing work can find all relocation positions throughout the whole blank in a reasonable amount of time. In this paper, we develop an efficient algorithm to solve this problem. The time complexity of our algorithm is linear in the number of features in the die. Experimental results with full die layouts generated from a standard cell library validate the efficiency of our algorithm. Comparing to the algorithm in [2] which runs more than one week without termination, our algorithm only takes several hours to find all relocation positions for a die with millions of features.

KW - Blank Defect Mitigation

KW - EUV

KW - Linear Time

KW - Multi-die Placement

KW - Relocation Positions

UR - http://www.scopus.com/inward/record.url?scp=84877725617&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84877725617&partnerID=8YFLogxK

U2 - 10.1109/ASPDAC.2013.6509606

DO - 10.1109/ASPDAC.2013.6509606

M3 - Conference contribution

AN - SCOPUS:84877725617

SN - 9781467330299

T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

SP - 261

EP - 266

BT - 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013

ER -