Latency Insertion Method for FinFET Simulation Incorporating Parasitic Source/Drain Resistances

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Three-dimensional FinFETs with well-suppressed short channel effects and low power consumption were introduced to replace traditional planar MOSFETs in sub-20 nm devices. However, the three-dimensional structure introduces numerous complex parasitic effects, which makes the simulation challenging. Developing fast and accurate simulation algorithms for FinFETs is thus critical to reduce verification time. The Latency Insertion Method (LIM) proved to be able to provide accurate and fast FinFET DC simulation in our previous work. In this paper, we focus on improving the robustness of the algorithm by incorporating parasitic source/drain resistances. Following the BSIM-CMG compact model, we introduced the LIM schematics for three different parasitic resistance modes. The simulation results of LIM are compared with commercial simulators to verify the accuracy and speed.

Original languageEnglish (US)
Title of host publication2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350390360
DOIs
StatePublished - 2024
Event10th IEEE Electronics System-Integration Technology Conference, ESTC 2024 - Berlin, Germany
Duration: Sep 11 2024Sep 13 2024

Publication series

Name2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings

Conference

Conference10th IEEE Electronics System-Integration Technology Conference, ESTC 2024
Country/TerritoryGermany
CityBerlin
Period9/11/249/13/24

Keywords

  • BSIM-CMG
  • circuit simulation
  • compact model
  • FinFET
  • latency insertion method

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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