@inproceedings{1d59bb05e71a4d33b1763a4edbde101b,
title = "Latency Insertion Method for Fast Electro-Thermal Simulation of FinFET with Self-Heating Effect",
abstract = "Self-heating effect (SHE) is prominent for FinFET devices due to their large currents and compact sizes. With SHE, the power in FinFETs is dissipated into heat, affecting device performance. Thus, fast and accurate electro-thermal analysis of FinFETs incorporating SHE is important. This paper proposes the Latency Insertion Method (LIM) algorithm for fast FinFET electro-thermal simulation with SHE. Based on the BSIM-CMG model, the proposed method leapfrogs between the conventional electrical LIM algorithm and the thermal equations. The LIM results are compared to SPICE-based commercial software to prove the accuracy and the speed.",
keywords = "BSIM-CMG, circuit simulation, electro-thermal simulation, FinFET, latency insertion method, self-heating effect",
author = "Yi Zhou and Schutt-Ain{\'e}, {Jos{\'e} E.}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024 ; Conference date: 06-10-2024 Through 09-10-2024",
year = "2024",
doi = "10.1109/EPEPS61853.2024.10754220",
language = "English (US)",
series = "33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024",
address = "United States",
}