Large-scale transient electrical-thermal co-simulation of interconnects under electromagnetic pulses

Tianjian Lu, Jianming Jin

Research output: Contribution to journalArticlepeer-review


The electrical-thermal co-simulation is employed to analyze the transient electrical and thermal behaviors of large-scale on-chip and 3-D interconnects. The analyses are performed when the interconnects are exposed to electromagnetic pulses in order to simulate both self-heating effects under normal working conditions and thermal breakdowns under electrostatic discharge stresses. The impact of power maps on the transient thermal responses under the electrostatic discharge stress is also studied.

Original languageEnglish (US)
Pages (from-to)2559-2563
Number of pages5
JournalMicrowave and Optical Technology Letters
Issue number11
StatePublished - Nov 1 2016


  • electrical-thermal co-simulation
  • electrostatic discharge
  • finite element tearing and interconnecting
  • on-chip and 3-D interconnects

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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