Large scale arrays of microcavity plasma devices based on encapsulated Al/Al2O3 electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing

S. J. Park; K. S. Kim; A. J. Price; P. A. Tchertchian; P. Y. Chen; J. K. Yoon; J. G. Eden

doi:10.1889/1.2785355

Large scale arrays of microcavity plasma devices based on encapsulated Al/Al₂O₃ electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing

S. J. Park
, K. S. Kim
, A. J. Price
, P. A. Tchertchian
, P. Y. Chen
, J. K. Yoon
, J. G. Eden

Electrical and Computer Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.

Original language	English (US)
Pages (from-to)	538-541
Number of pages	4
Journal	Digest of Technical Papers - SID International Symposium
Volume	38
Issue number	1
DOIs	https://doi.org/10.1889/1.2785355
State	Published - 2007
Event	2007 SID International Symposium - Long Beach, CA, United States Duration: May 23 2007 → May 25 2007

ASJC Scopus subject areas

General Engineering

Online availability

10.1889/1.2785355

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Cite this

Park, S. J., Kim, K. S., Price, A. J., Tchertchian, P. A., Chen, P. Y., Yoon, J. K., & Eden, J. G. (2007). Large scale arrays of microcavity plasma devices based on encapsulated Al/Al₂O₃ electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing. Digest of Technical Papers - SID International Symposium, 38(1), 538-541. https://doi.org/10.1889/1.2785355

Large scale arrays of microcavity plasma devices based on encapsulated Al/Al₂O₃ electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing. / Park, S. J.; Kim, K. S.; Price, A. J. et al.
In: Digest of Technical Papers - SID International Symposium, Vol. 38, No. 1, 2007, p. 538-541.

Research output: Contribution to journal › Conference article › peer-review

Park, SJ, Kim, KS, Price, AJ, Tchertchian, PA, Chen, PY, Yoon, JK & Eden, JG 2007, 'Large scale arrays of microcavity plasma devices based on encapsulated Al/Al₂O₃ electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing', Digest of Technical Papers - SID International Symposium, vol. 38, no. 1, pp. 538-541. https://doi.org/10.1889/1.2785355

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abstract = "Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.",

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