Large scale arrays of microcavity plasma devices based on encapsulated Al/Al2O3 electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing

S. J. Park; K. S. Kim; A. J. Price; P. A. Tchertchian; P. Y. Chen; J. K. Yoon; J. G. Eden

doi:10.1889/1.2785355

Large scale arrays of microcavity plasma devices based on encapsulated Al/Al₂O₃ electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing

S. J. Park, K. S. Kim, A. J. Price, P. A. Tchertchian, P. Y. Chen, J. K. Yoon, J. G. Eden

Electrical and Computer Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.

Original language	English (US)
Pages (from-to)	538-541
Number of pages	4
Journal	Digest of Technical Papers - SID International Symposium
Volume	38
Issue number	1
DOIs	https://doi.org/10.1889/1.2785355
State	Published - 2007
Event	2007 SID International Symposium - Long Beach, CA, United States Duration: May 23 2007 → May 25 2007

ASJC Scopus subject areas

General Engineering

Online availability

10.1889/1.2785355

Library availability

Discover UIUC Full Text

Cite this

Park, S. J., Kim, K. S., Price, A. J., Tchertchian, P. A., Chen, P. Y., Yoon, J. K., & Eden, J. G. (2007). Large scale arrays of microcavity plasma devices based on encapsulated Al/Al₂O₃ electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing. Digest of Technical Papers - SID International Symposium, 38(1), 538-541. https://doi.org/10.1889/1.2785355

Large scale arrays of microcavity plasma devices based on encapsulated Al/Al₂O₃ electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing. / Park, S. J.; Kim, K. S.; Price, A. J. et al.
In: Digest of Technical Papers - SID International Symposium, Vol. 38, No. 1, 2007, p. 538-541.

Research output: Contribution to journal › Conference article › peer-review

Park, SJ, Kim, KS, Price, AJ, Tchertchian, PA, Chen, PY, Yoon, JK & Eden, JG 2007, 'Large scale arrays of microcavity plasma devices based on encapsulated Al/Al₂O₃ electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing', Digest of Technical Papers - SID International Symposium, vol. 38, no. 1, pp. 538-541. https://doi.org/10.1889/1.2785355

@article{2184c7c60f154a7cad7cc2de7d5cf404,

title = "Large scale arrays of microcavity plasma devices based on encapsulated Al/Al2O3 electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing",

abstract = "Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.",

author = "Park, {S. J.} and Kim, {K. S.} and Price, {A. J.} and Tchertchian, {P. A.} and Chen, {P. Y.} and Yoon, {J. K.} and Eden, {J. G.}",

year = "2007",

doi = "10.1889/1.2785355",

language = "English (US)",

volume = "38",

pages = "538--541",

journal = "Digest of Technical Papers - SID International Symposium",

issn = "0097-966X",

publisher = "John Wiley & Sons, Ltd.",

number = "1",

note = "2007 SID International Symposium ; Conference date: 23-05-2007 Through 25-05-2007",

}

TY - JOUR

T1 - Large scale arrays of microcavity plasma devices based on encapsulated Al/Al2O3 electrodes

T2 - 2007 SID International Symposium

AU - Park, S. J.

AU - Kim, K. S.

AU - Price, A. J.

AU - Tchertchian, P. A.

AU - Chen, P. Y.

AU - Yoon, J. K.

AU - Eden, J. G.

PY - 2007

Y1 - 2007

N2 - Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.

AB - Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.

UR - http://www.scopus.com/inward/record.url?scp=34547898850&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34547898850&partnerID=8YFLogxK

U2 - 10.1889/1.2785355

DO - 10.1889/1.2785355

M3 - Conference article

AN - SCOPUS:34547898850

SN - 0097-966X

VL - 38

SP - 538

EP - 541

JO - Digest of Technical Papers - SID International Symposium

JF - Digest of Technical Papers - SID International Symposium

IS - 1

Y2 - 23 May 2007 through 25 May 2007

ER -