Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.
|Original language||English (US)|
|Number of pages||4|
|Journal||Digest of Technical Papers - SID International Symposium|
|State||Published - 2007|
|Event||2007 SID International Symposium - Long Beach, CA, United States|
Duration: May 23 2007 → May 25 2007
ASJC Scopus subject areas