Large scale arrays of microcavity plasma devices based on encapsulated Al/Al2O3 electrodes: Device characteristics as a plasma display pixel and low cost wet chemical fabrication processing

S. J. Park, K. S. Kim, A. J. Price, P. A. Tchertchian, P. Y. Chen, J. K. Yoon, J. G. Eden

Research output: Contribution to journalConference articlepeer-review

Abstract

Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.

Original languageEnglish (US)
Pages (from-to)538-541
Number of pages4
JournalDigest of Technical Papers - SID International Symposium
Volume38
Issue number1
DOIs
StatePublished - 2007
Event2007 SID International Symposium - Long Beach, CA, United States
Duration: May 23 2007May 25 2007

ASJC Scopus subject areas

  • Engineering(all)

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