Abstract
Addressable, large scale arrays of microcavity plasma devices have been fabricated by wet chemical processes. Dielectric encapsulated aluminum microcavity electrodes having cavities with a diameter of 100-200 μm are formed by wet electrochemical process suitable for low cost manufacturing. This presentation reports device structure and cell designs for high pressure Xe microplasmas.
Original language | English (US) |
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Pages (from-to) | 538-541 |
Number of pages | 4 |
Journal | Digest of Technical Papers - SID International Symposium |
Volume | 38 |
Issue number | 1 |
DOIs | |
State | Published - 2007 |
Event | 2007 SID International Symposium - Long Beach, CA, United States Duration: May 23 2007 → May 25 2007 |
ASJC Scopus subject areas
- General Engineering