Large-area, selective transfer of microstructured silicon: A printing-based approach to high-performance thin-film transistors supported on flexible substrates

Keon Jae Lee, Michael J. Motala, Matthew A. Meitl, William R. Childs, Etienne Menard, Anne K. Shim, John A. Rogers, Ralph G. Nuzzo

Research output: Contribution to journalArticlepeer-review

Abstract

A printing-based approach to high-performance thin-film transistors supported on flexible substrates was studied by a large-area, selective transfer of microstructured silicon. In Method I, a peanut-shaped photoresist pattern was developed on top of a SOI substrate using standard photolithography techniques. Method II uses a masterless soft-lithography technique to chemically bond the μs-Si to a PDMS-coated substrate. After heating, the PDMS was peeled from the SOI, resulting in patterned transfer of μs-Si to the UVO-modified regions of the PDMS.

Original languageEnglish (US)
Pages (from-to)2332-2336
Number of pages5
JournalAdvanced Materials
Volume17
Issue number19
DOIs
StatePublished - Oct 4 2005

ASJC Scopus subject areas

  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering

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