Large area, rubber stamped plastic sheets of active matrix backplane circuitry for electronic paper

J. A. Rogers, K. Baldwin, Z. Bao, B. Crone, A. Dodabalapur, Y. Y. Lin, V. R. Raju

Research output: Contribution to journalConference articlepeer-review

Abstract

A high resolution technique for rubber stamping, known as microcontact printing (μCP), offers many features that are well suited for fabricating low cost organic electronic systems. This paper illustrates the use of μCP for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 micron) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processings sequences may be attractive for new types of plastic electronic devices for consumer applications.

Original languageEnglish (US)
Pages (from-to)507-513
Number of pages7
JournalAdvanced Metallization Conference (AMC)
StatePublished - Dec 1 2000
EventAdvanced Metallization Conference 2000 - San Diego, CA, United States
Duration: Oct 2 2000Oct 4 2000

ASJC Scopus subject areas

  • Chemical Engineering(all)

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