Kinetically controlled, adhesiveless transfer printing using microstructured stamps

Tae Ho Kim, Andrew Carlson, Jong Hyun Ahn, Sang Min Won, Shuodao Wang, Yonggang Huang, John A. Rogers

Research output: Contribution to journalArticlepeer-review


This letter describes the physics and application of an approach to transfer printing that uses stamps with microstructures of relief embossed into their surfaces. Experimental measurement of velocity-dependent adhesive strength as a function of relief geometry reveals key scaling properties and provides a means for comparison to theoretical expectation. Formation of transistor devices that use nanoribbons of silicon transfer printed directly onto glass substrates without adhesive layers demonstrates the use of this type of approach for a high-performance (mobilities > 325 cm2 /V s and on/off ratios > 105) single crystal silicon on glass technology.

Original languageEnglish (US)
Article number113502
JournalApplied Physics Letters
Issue number11
StatePublished - 2009

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)


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