ITEM: A temperature-dependent electromigration reliability diagnosis tool

Chin Chi Teng, Yi Kan Cheng, Elyse Rosenbaum, Sung Mo Kang

Research output: Contribution to journalArticle

Abstract

In this paper, we present a new electromigration reliability diagnosis tool (iTEM) for CMOS VLSI circuits. Unlike previous electromigration reliability tools, iTEM can estimate the interconnect temperature rise due to joule heating and heat conduction from the substrate using a newly developed lumped thermal model. By including the temperature effect, iTEM provides much more accurate electromigration reliability diagnosis. Moreover, it is computationally efficient, and can analyze circuit layouts containing tens of thousands of transistors on a desktop workstation.

Original languageEnglish (US)
Pages (from-to)882-893
Number of pages12
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume16
Issue number8
DOIs
StatePublished - Dec 1 1997
Externally publishedYes

Fingerprint

Electromigration
Integrated circuit layout
Joule heating
VLSI circuits
Heat conduction
Thermal effects
Temperature
Transistors
Substrates

ASJC Scopus subject areas

  • Software
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

Cite this

ITEM : A temperature-dependent electromigration reliability diagnosis tool. / Teng, Chin Chi; Cheng, Yi Kan; Rosenbaum, Elyse; Kang, Sung Mo.

In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 16, No. 8, 01.12.1997, p. 882-893.

Research output: Contribution to journalArticle

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