In this paper, we present a new electromigration reliability diagnosis tool (iTEM) for CMOS VLSI circuits. Unlike previous electromigration reliability tools, iTEM can estimate the interconnect temperature rise due to joule heating and heat conduction from the substrate using a newly developed lumped thermal model. By including the temperature effect, iTEM provides much more accurate electromigration reliability diagnosis. Moreover, it is computationally efficient, and can analyze circuit layouts containing tens of thousands of transistors on a desktop workstation.
|Original language||English (US)|
|Number of pages||12|
|Journal||IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems|
|State||Published - Dec 1 1997|
ASJC Scopus subject areas
- Computer Graphics and Computer-Aided Design
- Electrical and Electronic Engineering