ITEM: A temperature-dependent electromigration reliability diagnosis tool

Chin Chi Teng; Yi Kan Cheng; Elyse Rosenbaum; Sung Mo Kang

doi:10.1109/43.644613

ITEM: A temperature-dependent electromigration reliability diagnosis tool

Chin Chi Teng, Yi Kan Cheng, Elyse Rosenbaum, Sung Mo Kang

Research output: Contribution to journal › Article › peer-review

Abstract

In this paper, we present a new electromigration reliability diagnosis tool (iTEM) for CMOS VLSI circuits. Unlike previous electromigration reliability tools, iTEM can estimate the interconnect temperature rise due to joule heating and heat conduction from the substrate using a newly developed lumped thermal model. By including the temperature effect, iTEM provides much more accurate electromigration reliability diagnosis. Moreover, it is computationally efficient, and can analyze circuit layouts containing tens of thousands of transistors on a desktop workstation.

Original language	English (US)
Pages (from-to)	882-893
Number of pages	12
Journal	IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume	16
Issue number	8
DOIs	https://doi.org/10.1109/43.644613
State	Published - 1997
Externally published	Yes

ASJC Scopus subject areas

Software
Computer Graphics and Computer-Aided Design
Electrical and Electronic Engineering

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10.1109/43.644613

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title = "ITEM: A temperature-dependent electromigration reliability diagnosis tool",

abstract = "In this paper, we present a new electromigration reliability diagnosis tool (iTEM) for CMOS VLSI circuits. Unlike previous electromigration reliability tools, iTEM can estimate the interconnect temperature rise due to joule heating and heat conduction from the substrate using a newly developed lumped thermal model. By including the temperature effect, iTEM provides much more accurate electromigration reliability diagnosis. Moreover, it is computationally efficient, and can analyze circuit layouts containing tens of thousands of transistors on a desktop workstation.",

author = "Teng, {Chin Chi} and Cheng, {Yi Kan} and Elyse Rosenbaum and Kang, {Sung Mo}",

note = "Funding Information: Manuscript received October 30, 1996; revised July 28, 1997. This work was supported by JSEP (N00014-95-J-1270), Air Force Rome Laboratory (F30602-95-C-0069), Texas Instruments, and Intel Corporation. This paper was recommended by Associate Editor D. Ling. C.-C. Teng is with the Avant! Corporation, Fremont, CA 94538 USA. Y.-K. Cheng is with the Somerset Design Center, IBM Corporation, Austin, TX 78730 USA. E. Rosenbaum and S.-M. Kang are with the Coordinated Science Laboratory, Department of Electrical and Computer Engineering, University of Illinois at Urbana–Champaign, Urbana, IL 61801 USA. Publisher Item Identifier S 0278-0070(97)08474-1.",

year = "1997",

doi = "10.1109/43.644613",

language = "English (US)",

volume = "16",

pages = "882--893",

journal = "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems",

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publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "8",

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T1 - ITEM

T2 - A temperature-dependent electromigration reliability diagnosis tool

AU - Teng, Chin Chi

AU - Cheng, Yi Kan

AU - Rosenbaum, Elyse

AU - Kang, Sung Mo

N1 - Funding Information: Manuscript received October 30, 1996; revised July 28, 1997. This work was supported by JSEP (N00014-95-J-1270), Air Force Rome Laboratory (F30602-95-C-0069), Texas Instruments, and Intel Corporation. This paper was recommended by Associate Editor D. Ling. C.-C. Teng is with the Avant! Corporation, Fremont, CA 94538 USA. Y.-K. Cheng is with the Somerset Design Center, IBM Corporation, Austin, TX 78730 USA. E. Rosenbaum and S.-M. Kang are with the Coordinated Science Laboratory, Department of Electrical and Computer Engineering, University of Illinois at Urbana–Champaign, Urbana, IL 61801 USA. Publisher Item Identifier S 0278-0070(97)08474-1.

PY - 1997

Y1 - 1997

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ITEM: A temperature-dependent electromigration reliability diagnosis tool

Abstract

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