Iron redistribution and compensation mechanisms in semi-insulating Si-implanted InP

G. Bahir, J. L. Merz, J. R. Abelson, T. W. Sigmon

Research output: Contribution to journalArticlepeer-review

Abstract

The Si and Fe depth distributions have been measured in Si-implanted semi-insulating (SI) InP as a function of implant temperature and post-implant annealing technique (either furnace annealing or rapid thermal annealing). Depth profiles obtained by secondary ion mass spectrometry and damage measurements obtained by Rutherford backscattering demonstrate that Fe redistributes into regions of residual damage during thermal processing. The active electrical carrier profiles measured by electrochemical profiling show differences between atomic and electrical carrier profiles which depend on whether the substrate is semi-insulating or undoped, and on the implant temperature. These differences are interpreted in terms of three different compensating mechanisms: (a) the amphoteric nature of Si impurities in InP, so that Si can be self-compensating, (b) carrier compensation caused by the redistribution of Fe, and (c) implantation-related damage effects and/or stoichiometry imbalance induced by the Si implant.

Original languageEnglish (US)
Pages (from-to)1009-1017
Number of pages9
JournalJournal of Applied Physics
Volume65
Issue number3
DOIs
StatePublished - 1989
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Fingerprint

Dive into the research topics of 'Iron redistribution and compensation mechanisms in semi-insulating Si-implanted InP'. Together they form a unique fingerprint.

Cite this