(Invited) cross-layer resilience

Challenges, insights, and the road ahead

Eric Cheng, Daniel Mueller-Gritschneder, Jacob Abraham, Pradip Bose, Alper Buyuktosunoglu, Deming Chen, Hyungmin Cho, Yanjing Li, Uzair Sharif, Kevin Skadron, Mircea Stan, Ulf Schlichtmann, Subhasish Mitra

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Resilience to errors in the underlying hardware is a key design objective for a large class of computing systems, from embedded systems all the way to the cloud. Sources of hardware errors include radiation, circuit aging, variability induced by manufacturing and operating conditions, manufacturing test escapes, and early-life failures. Many publications have suggested that cross-layer resilience, where multiple error resilience techniques from different layers of the system stack cooperate to achieve cost-effective resilience, is essential for designing cost-effective resilient digital systems. This paper presents a comprehensive overview of crosslayer resilience by addressing fundamental cross-layer resilience questions, by summarizing insights derived from recent advances in cross-layer resilience research, and by discussing future crosslayer resilience challenges.

Original languageEnglish (US)
Title of host publicationProceedings of the 56th Annual Design Automation Conference 2019, DAC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450367257
DOIs
StatePublished - Jun 2 2019
Event56th Annual Design Automation Conference, DAC 2019 - Las Vegas, United States
Duration: Jun 2 2019Jun 6 2019

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Conference

Conference56th Annual Design Automation Conference, DAC 2019
CountryUnited States
CityLas Vegas
Period6/2/196/6/19

Fingerprint

Cross-layer
Resilience
Hardware
Embedded systems
Costs
Aging of materials
Manufacturing
Radiation
Error Resilience
Networks (circuits)
Embedded Systems
Computing

Keywords

  • Cross-layer resilience
  • Fault tolerance
  • Reliability

ASJC Scopus subject areas

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Modeling and Simulation

Cite this

Cheng, E., Mueller-Gritschneder, D., Abraham, J., Bose, P., Buyuktosunoglu, A., Chen, D., ... Mitra, S. (2019). (Invited) cross-layer resilience: Challenges, insights, and the road ahead. In Proceedings of the 56th Annual Design Automation Conference 2019, DAC 2019 [a198] (Proceedings - Design Automation Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/3316781.3323474

(Invited) cross-layer resilience : Challenges, insights, and the road ahead. / Cheng, Eric; Mueller-Gritschneder, Daniel; Abraham, Jacob; Bose, Pradip; Buyuktosunoglu, Alper; Chen, Deming; Cho, Hyungmin; Li, Yanjing; Sharif, Uzair; Skadron, Kevin; Stan, Mircea; Schlichtmann, Ulf; Mitra, Subhasish.

Proceedings of the 56th Annual Design Automation Conference 2019, DAC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. a198 (Proceedings - Design Automation Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cheng, E, Mueller-Gritschneder, D, Abraham, J, Bose, P, Buyuktosunoglu, A, Chen, D, Cho, H, Li, Y, Sharif, U, Skadron, K, Stan, M, Schlichtmann, U & Mitra, S 2019, (Invited) cross-layer resilience: Challenges, insights, and the road ahead. in Proceedings of the 56th Annual Design Automation Conference 2019, DAC 2019., a198, Proceedings - Design Automation Conference, Institute of Electrical and Electronics Engineers Inc., 56th Annual Design Automation Conference, DAC 2019, Las Vegas, United States, 6/2/19. https://doi.org/10.1145/3316781.3323474
Cheng E, Mueller-Gritschneder D, Abraham J, Bose P, Buyuktosunoglu A, Chen D et al. (Invited) cross-layer resilience: Challenges, insights, and the road ahead. In Proceedings of the 56th Annual Design Automation Conference 2019, DAC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. a198. (Proceedings - Design Automation Conference). https://doi.org/10.1145/3316781.3323474
Cheng, Eric ; Mueller-Gritschneder, Daniel ; Abraham, Jacob ; Bose, Pradip ; Buyuktosunoglu, Alper ; Chen, Deming ; Cho, Hyungmin ; Li, Yanjing ; Sharif, Uzair ; Skadron, Kevin ; Stan, Mircea ; Schlichtmann, Ulf ; Mitra, Subhasish. / (Invited) cross-layer resilience : Challenges, insights, and the road ahead. Proceedings of the 56th Annual Design Automation Conference 2019, DAC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings - Design Automation Conference).
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