Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging

P. J. Shang, Z. Q. Liu, D. X. Li, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

Microstructural investigations were performed on the interfacial reactions between eutectic SnIn solder and Cu substrate during reflowing at 433 K and solid-state aging at 373 K. Cu2(In,Sn) was identified as the only intermetallic compound (IMC) at the interface, which consists of two sublayers with different morphology, a fine-grained sublayer at the Cu side and a coarse-grained sublayer at the solder side. During solid-state aging, voids were found between these two Cu2(In,Sn) sublayers but not at the substrate interface, which is also attributed to the Kirkendall effect considering the different diffusion fluxes of Sn or In and Cu atoms in different sublayers.

Original languageEnglish (US)
Pages (from-to)410-417
Number of pages8
JournalPhilosophical Magazine Letters
Volume91
Issue number6
DOIs
StatePublished - Jun 2011

Keywords

  • Kirkendall void
  • SnIn solder
  • diffusion
  • interfaces
  • intermetallic compounds

ASJC Scopus subject areas

  • Condensed Matter Physics

Fingerprint Dive into the research topics of 'Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging'. Together they form a unique fingerprint.

Cite this