Abstract
The thermal conductance of transfer-printed interfaces is found to be surprisingly high, only a factor of 2-10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer-printing and provide fundamental insights on the nature of solid-solid contacts between elastically stiff materials.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 5028-5033 |
| Number of pages | 6 |
| Journal | Advanced Materials |
| Volume | 23 |
| Issue number | 43 |
| DOIs | |
| State | Published - Nov 16 2011 |
Keywords
- characterization tools
- flexible electronics
- microcontact printing
- structure-property relationships
- thin films
ASJC Scopus subject areas
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering