Abstract
Effect of electromigration on the interfacial structure of solder interconnects was examined in a Sn-Bi/Cu interconnect system. At current densities above 102 A/cm2, Bi migrated along the direction of the electron flow in the solder alloy. A continuous Bi layer was found at the solder interface on the anode side, while a Sn-rich region formed at the cathode side of the electrical connection. The presence of the Bi layer inhibited further growth of Cu-Sn intermetallic phase at the interface by acting as a diffusion barrier to the reacting species.
Original language | English (US) |
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Pages (from-to) | 1363-1367 |
Number of pages | 5 |
Journal | Journal of Electronic Materials |
Volume | 34 |
Issue number | 11 |
DOIs | |
State | Published - Nov 2005 |
Externally published | Yes |
Keywords
- Electromigration
- Interconnect
- Interface
- Solder
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry