Interfacial reactions between In-Sn solder and Ni-Fe platings

Keyphrases

• 2-phase 33%
• Annealing 33%
• Annealing Studies 33%
• Apparent Activation Energy 33%
• Cu6Sn5 33%
• Eutectic Solder 33%
• Faceted Structure 33%
• Fe Content 33%
• Fe-rich 66%
• FeSn 33%
• Globular 33%
• In-Sn 100%
• Interfacial Interaction 33%
• Interfacial Reaction 100%
• Intermetallic Compounds 66%
• Kinetic Study 33%
• Metallization 33%
• Morphological Structure 33%
• Ni-rich 33%
• NiFe 100%
• Reflow 66%
• Rich Systems 33%
• Scanning Electron Microscopy 33%
• Soldering 100%
• Structure Composition 33%
• Transmission Electron Microscopy 33%

Material Science

• Activation Energy 50%
• Intermetallics 100%
• Plating 100%
• Scanning Electron Microscopy 100%
• Structure (Composition) 50%
• Transmission Electron Microscopy 50%