Interfacial reactions between In-Sn solder and Ni-Fe platings

John P. Daghfal; P. J. Shang; Z. Q. Liu; J. K. Shang

doi:10.1007/s11664-009-0896-y

Interfacial reactions between In-Sn solder and Ni-Fe platings

John P. Daghfal, P. J. Shang, Z. Q. Liu, J. K. Shang

Research output: Contribution to journal › Article › peer-review

Abstract

Interfacial interactions in a Ni-xFe-Sn-In eutectic solder (x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni ₃Sn ₄ and FeSn ₂ phases appeared at the interface along with Cu ₆Sn ₅ in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni ₃Sn ₄ crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing.

Original language	English (US)
Pages (from-to)	2506-2515
Number of pages	10
Journal	Journal of Electronic Materials
Volume	38
Issue number	12
DOIs	https://doi.org/10.1007/s11664-009-0896-y
State	Published - Dec 2009
Externally published	Yes

Keywords

Faceting
FeSn
In-Sn solder
Interface
Ni Sn
Ni-Fe metallization

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Online availability

10.1007/s11664-009-0896-y

Library availability

Discover UIUC Full Text

Cite this

@article{d84017eb09b04db7b281eefca07f0e57,

title = "Interfacial reactions between In-Sn solder and Ni-Fe platings",

abstract = "Interfacial interactions in a Ni-xFe-Sn-In eutectic solder (x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni 3Sn 4 and FeSn 2 phases appeared at the interface along with Cu 6Sn 5 in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni 3Sn 4 crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing.",

keywords = "Faceting, FeSn, In-Sn solder, Interface, Ni Sn, Ni-Fe metallization",

author = "Daghfal, {John P.} and Shang, {P. J.} and Liu, {Z. Q.} and Shang, {J. K.}",

year = "2009",

month = dec,

doi = "10.1007/s11664-009-0896-y",

language = "English (US)",

volume = "38",

pages = "2506--2515",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "12",

}

TY - JOUR

T1 - Interfacial reactions between In-Sn solder and Ni-Fe platings

AU - Daghfal, John P.

AU - Shang, P. J.

AU - Liu, Z. Q.

AU - Shang, J. K.

PY - 2009/12

Y1 - 2009/12

N2 - Interfacial interactions in a Ni-xFe-Sn-In eutectic solder (x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni 3Sn 4 and FeSn 2 phases appeared at the interface along with Cu 6Sn 5 in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni 3Sn 4 crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing.

AB - Interfacial interactions in a Ni-xFe-Sn-In eutectic solder (x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni 3Sn 4 and FeSn 2 phases appeared at the interface along with Cu 6Sn 5 in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni 3Sn 4 crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing.

KW - Faceting

KW - FeSn

KW - In-Sn solder

KW - Interface

KW - Ni Sn

KW - Ni-Fe metallization

UR - http://www.scopus.com/inward/record.url?scp=72549112252&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=72549112252&partnerID=8YFLogxK

U2 - 10.1007/s11664-009-0896-y

DO - 10.1007/s11664-009-0896-y

M3 - Article

AN - SCOPUS:72549112252

SN - 0361-5235

VL - 38

SP - 2506

EP - 2515

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 12

ER -

Interfacial reactions between In-Sn solder and Ni-Fe platings

Abstract

Keywords

ASJC Scopus subject areas

Online availability

Library availability

Related links

Fingerprint

Cite this