Abstract
Interfacial interactions in a Ni-xFe-Sn-In eutectic solder (x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni 3Sn 4 and FeSn 2 phases appeared at the interface along with Cu 6Sn 5 in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni 3Sn 4 crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing.
Original language | English (US) |
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Pages (from-to) | 2506-2515 |
Number of pages | 10 |
Journal | Journal of Electronic Materials |
Volume | 38 |
Issue number | 12 |
DOIs | |
State | Published - Dec 2009 |
Keywords
- Faceting
- FeSn
- In-Sn solder
- Interface
- Ni Sn
- Ni-Fe metallization
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry