Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating

  • Fei Li
  • , Chunzhon Liu
  • , Aiping Xian
  • , Jianku Shang

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating'. Together they form a unique fingerprint.

Keyphrases

Engineering

Material Science