Abstract
Interfacial reactions between eutectic Sn-58Bi lead-free solder and Cu or electroless Ni-P plating were studied. The joining temperature was 180°C , the aging temperature was 60°C -120°C , and the aging time was 5 to 30 d. The interfacial reaction products determined by SEM, EDAX and XRD are Cu6Sn5 on the solder/Cu interface, and Ni3Sn4 on the solder/Ni-P interface. In addition, there is a P-rich layer between Ni3Sn4 and Ni layer. The growth rate of Cu6Sns is much faster than that of Ni3Sn4. The growth rate of Ni3Sn4 was found to decrease with increasing P content in the electroless Ni-P plating. The kinetics of the intermetallic compound growth follows a parabolic law of time, as controlled by the diffusion mechanism. The apparent activation energies are 90.87 kJ/mol for the growth of Cu6Sn5, 101.43 kJ/mol for Ni3Sn4 on Ni-9%P plating and 117.31 kJ/mol for Ni3Sn4 on Ni-16%P plate, respectively.
Original language | English (US) |
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Pages (from-to) | 815-821 |
Number of pages | 7 |
Journal | Jinshu Xuebao/Acta Metallurgica Sinica |
Volume | 40 |
Issue number | 8 |
State | Published - Aug 2004 |
Externally published | Yes |
Keywords
- Electro-less Ni-P plating
- Interfacial reaction
- Intermetallic compound
- Lead-free solder
- Sn-Bi alloy
ASJC Scopus subject areas
- Geotechnical Engineering and Engineering Geology
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys