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Interface analysis of Ti/Al/Ti/Au ohmic contacts with regrown n +-GaN layers using molecular beam epitaxy
Hui Chan Seo, Shankar Sivaramakrishnan, Jian Min Zuo, Liang Pang, Philip T. Krein, Kyekyoon Kim
- Materials Science and Engineering
- Materials Research Lab
- Electrical and Computer Engineering
- Bioengineering
- Nuclear, Plasma, and Radiological Engineering
- Carl R. Woese Institute for Genomic Biology
- Micro and Nanotechnology Lab
- Beckman Institute for Advanced Science and Technology
- Grainger College of Engineering
- Coordinated Science Lab
- Neuroscience Program
Research output: Contribution to journal › Article › peer-review