Interconnect thermal modeling for determining design limits on current density

Keyphrases

• Design Requirements 100%
• Current Density 100%
• Thermal Modeling 100%
• On-state Current 100%
• Thermal Coupling 100%
• Numerical Results 50%
• Design Rules 50%
• Temperature Rise 50%
• Current Carrying Capacity 50%
• Metal Levels 50%
• Dense Array 50%
• Coupling Effect 50%
• Substrate Temperature 50%
• 3D Finite Element Analysis 50%
• Semi-empirical Formula 50%
• No More than 5 50%
• Average Current Density 50%

Engineering

• Interconnects 100%
• Limit Design 100%
• Design Rule 33%
• Coupling Effect 33%
• Substrate Temperature 33%
• Temperature Rise 33%
• Finite Element Analysis 33%

Physics

• Thermal Design 100%
• Finite Element Analysis 100%