Abstract
We apply 3-D finite element analysis to study the thermal coupling between nearby interconnects. We find that the temperature rise in current-carrying lines is significantly influenced by a dense array of lines in the adjacent metal level. In contrast, thermal coupling between just two neighboring lines is insignificant for most geometries. Design rules for average current density are provided for specific geometries given the requirement that the interconnect temperature be no more than 5 °C above the substrate temperature. Semi-empirical formulae for coupling effects are presented based on the numerical results.
| Original language | English (US) |
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| Pages | 172-178 |
| Number of pages | 7 |
| DOIs | |
| State | Published - 1999 |
| Event | Proceedings of the 1999 International Symposium on Physical Design, ISPD-99 - Monterey, CA, USA Duration: Apr 12 1999 → Apr 14 1999 |
Conference
| Conference | Proceedings of the 1999 International Symposium on Physical Design, ISPD-99 |
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| City | Monterey, CA, USA |
| Period | 4/12/99 → 4/14/99 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering