Interconnect simulation using order reduction and scattering parameters

W. T. Beyene, J. E. Schutt-Aine

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper demonstrates the use of scattering parameters for efficient and accurate simulation of transmission lines. First, a low-order rational approximation scheme is applied to the s parameters of the line system, next an appropriate reference system is chosen to optimize the formulation. Finally, the low-order rational approximations of the scattering parameters are directly implemented in conventional time-domain simulator using recursive convolution. Experimental results are used to validate the computer simulations.

Original languageEnglish (US)
Title of host publication1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages627-631
Number of pages5
ISBN (Print)0780345266
DOIs
StatePublished - Jan 1 1998
Event48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States
Duration: May 25 1998May 28 1998

Publication series

NameProceedings - Electronic Components and Technology Conference
VolumePart F133492
ISSN (Print)0569-5503

Other

Other48th Electronic Components and Technology Conference, ECTC 1998
CountryUnited States
CitySeattle
Period5/25/985/28/98

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Beyene, W. T., & Schutt-Aine, J. E. (1998). Interconnect simulation using order reduction and scattering parameters. In 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998 (pp. 627-631). [678761] (Proceedings - Electronic Components and Technology Conference; Vol. Part F133492). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.1998.678761