Interconnect properties and multilayer bandpass filter design in LTCC substrates

The effects of a perforated ground plane on multilayer interconnect structures fabricated in low temperature co-fired ceramic are examined. Simple transmission lines and coupled transmission lines have been designed and simulated. Results are presented to aid in the design of planar passive embedded components such as couplers, filters, and transformers. Several geometries are considered to increase design flexibility. These geometries include lines with various amounts of dielectric overlay and lines over perforations in the ground plane. In addition, several bandpass filters, including multilayer filters, are designed using simulation results to further examine the LTCC environment.