Interconnect properties and multilayer bandpass filter design in LTCC substrates

Scott A. Raby, Andreas C Cangellaris

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effects of a perforated ground plane on multilayer interconnect structures fabricated in low temperature co-fired ceramic are examined. Simple transmission lines and coupled transmission lines have been designed and simulated. Results are presented to aid in the design of planar passive embedded components such as couplers, filters, and transformers. Several geometries are considered to increase design flexibility. These geometries include lines with various amounts of dielectric overlay and lines over perforations in the ground plane. In addition, several bandpass filters, including multilayer filters, are designed using simulation results to further examine the LTCC environment.

Original languageEnglish (US)
Title of host publicationAnnual Wireless Communications Conference, Proceedings
PublisherIEEE
Pages187-192
Number of pages6
StatePublished - 1997
Externally publishedYes
EventProceedings of the 1997 Annual Wireless Communications Conference - Boulder, CA, USA
Duration: Aug 11 1997Aug 13 1997

Other

OtherProceedings of the 1997 Annual Wireless Communications Conference
CityBoulder, CA, USA
Period8/11/978/13/97

    Fingerprint

ASJC Scopus subject areas

  • Computer Science(all)
  • Engineering(all)

Cite this

Raby, S. A., & Cangellaris, A. C. (1997). Interconnect properties and multilayer bandpass filter design in LTCC substrates. In Annual Wireless Communications Conference, Proceedings (pp. 187-192). IEEE.