TY - GEN
T1 - INTEGRATED MESOSCOPIC COOLER CIRCUITS (IMCCS)
AU - Shannon, Mark A.
AU - Philpott, Mike L.
AU - Miller, Norman R.
AU - Bullard, Clark W.
AU - Beebe, David J.
AU - Jacobi, Anthony M.
AU - Hrnjak, Predag S.
AU - Saif, Taher
AU - Aluru, Narayan
AU - Sehitoglu, Huseyin
AU - Rockett, Angus
AU - Economy, James
N1 - The authors would like to acknowledge DARPA DSO, contract #DABT63-97-C-0069, for their support of this work. We would also like to thank all the students, post-docs, and research engineers al UIUC who have given their dedicated effort to make the IMCC a reality: E. Alaca, J. Cartwright, S. Chang, A. Fischer, B. Flachsbari, A. Hall, D. He, B. Jiang, D. Long, M. Mangriot, M. Marshall, S. Mehendal, G. Miller, G. Moore. J. Selby. S. Stout. M. Sulfridge. X. Tu, Y. Wu. and K. Xu.
PY - 1999
Y1 - 1999
N2 - This paper presents the design, fabrication approach, and initial results on the development of an active composite fabric comprising a system of energy-efficient micro-miniature vapor-compression heat pumps to form integrated mesoscopic cooler circuits (IMCCs). Waferscale microfabrication, traditional volume processes such as injection molding, and new layered fabrication techniques have been combined with a scale-efficient vapor-compression cycle. The resulting IMCC offers significant improvements in cooling efficiency over normalscale refrigeration. The flexible polymer-based IMCC patches may be interconnected to form distributed fault-tolerant refrigeration circuits for a wide variety of applications. Potential applications include microclimate control for military, space, and fire fighting personnel, on-board/chip cooling of electronic devices, medical applications requiring highly localized and/or efficient temperature control, and automotive comfort control devices.
AB - This paper presents the design, fabrication approach, and initial results on the development of an active composite fabric comprising a system of energy-efficient micro-miniature vapor-compression heat pumps to form integrated mesoscopic cooler circuits (IMCCs). Waferscale microfabrication, traditional volume processes such as injection molding, and new layered fabrication techniques have been combined with a scale-efficient vapor-compression cycle. The resulting IMCC offers significant improvements in cooling efficiency over normalscale refrigeration. The flexible polymer-based IMCC patches may be interconnected to form distributed fault-tolerant refrigeration circuits for a wide variety of applications. Potential applications include microclimate control for military, space, and fire fighting personnel, on-board/chip cooling of electronic devices, medical applications requiring highly localized and/or efficient temperature control, and automotive comfort control devices.
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U2 - 10.1115/IMECE1999-0812
DO - 10.1115/IMECE1999-0812
M3 - Conference contribution
AN - SCOPUS:2442422654
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 75
EP - 82
BT - Advanced Energy Systems
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999
Y2 - 14 November 1999 through 19 November 1999
ER -