Mark A. Shannon, Mike L. Philpott, Norman R. Miller, Clark W. Bullard, David J. Beebe, Anthony M. Jacobi, Predag S. Hrnjak, Taher Saif, Narayan Aluru, Huseyin Sehitoglu, Angus Rockett, James Economy

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper presents the design, fabrication approach, and initial results on the development of an active composite fabric comprising a system of energy-efficient micro-miniature vapor-compression heat pumps to form integrated mesoscopic cooler circuits (IMCCs). Waferscale microfabrication, traditional volume processes such as injection molding, and new layered fabrication techniques have been combined with a scale-efficient vapor-compression cycle. The resulting IMCC offers significant improvements in cooling efficiency over normalscale refrigeration. The flexible polymer-based IMCC patches may be interconnected to form distributed fault-tolerant refrigeration circuits for a wide variety of applications. Potential applications include microclimate control for military, space, and fire fighting personnel, on-board/chip cooling of electronic devices, medical applications requiring highly localized and/or efficient temperature control, and automotive comfort control devices.

Original languageEnglish (US)
Title of host publicationAdvanced Energy Systems
PublisherAmerican Society of Mechanical Engineers (ASME)
Number of pages8
ISBN (Electronic)9780791816509
StatePublished - 1999
EventASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999 - Nashville, United States
Duration: Nov 14 1999Nov 19 1999

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)


ConferenceASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999
Country/TerritoryUnited States

ASJC Scopus subject areas

  • Mechanical Engineering


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