@inproceedings{3de0ea9a5af642449b1bb538e47e83da,
title = "Integrated mesoscopic cooler circuits (IMCCS)",
abstract = "This paper presents the design, fabrication approach, and initial results on the development of an active composite fabric comprising a system of energy-efficient micro-miniature vapor-compression heat pumps to form integrated mesoscopic cooler circuits (IMCCs). Wafer-scale microfabrication, traditional volume processes such as injection molding, and new layered fabrication techniques have been combined with a scale-efficient vapor-compression cycle. The resulting IMCC offers significant improvements in cooling efficiency over normal-scale refrigeration. The flexible polymer-based IMCC patches may be interconnected to form distributed fault-tolerant refrigeration circuits for a wide variety of applications. Potential applications include microclimate control for military, space, and fire fighting personnel, on-board/chip cooling of electronic devices, medical applications requiring highly localized and/or efficient temperature control, and automotive comfort control devices.",
author = "Shannon, {Mark A.} and Philpott, {Mike L.} and Miller, {Norman R.} and Bullard, {Clark W.} and Beebe, {David J.} and Jacobi, {Anthony M.} and Hrnjak, {Predag S.} and Taher Saif and Narayan Aluru and Huseyin Sehitoglu and Angus Rockett and James Economy",
year = "1999",
language = "English (US)",
isbn = "0791816508",
series = "American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES",
publisher = "ASME",
pages = "75--82",
booktitle = "American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES",
note = "Advanced Energy Systems Division - 1999 (The ASME International Mechanical Engineering Congress and Exposition) ; Conference date: 14-11-1999 Through 19-11-1999",
}