Integrated mesoscopic cooler circuits (IMCCS)

Mark A. Shannon, Mike L. Philpott, Norman R. Miller, Clark W. Bullard, David J. Beebe, Anthony M Jacobi, Predrag Stojan Hrnjak, M Taher A Saif, Narayana R Aluru, Huseyin Sehitoglu, Angus Rockett, James Economy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the design, fabrication approach, and initial results on the development of an active composite fabric comprising a system of energy-efficient micro-miniature vapor-compression heat pumps to form integrated mesoscopic cooler circuits (IMCCs). Wafer-scale microfabrication, traditional volume processes such as injection molding, and new layered fabrication techniques have been combined with a scale-efficient vapor-compression cycle. The resulting IMCC offers significant improvements in cooling efficiency over normal-scale refrigeration. The flexible polymer-based IMCC patches may be interconnected to form distributed fault-tolerant refrigeration circuits for a wide variety of applications. Potential applications include microclimate control for military, space, and fire fighting personnel, on-board/chip cooling of electronic devices, medical applications requiring highly localized and/or efficient temperature control, and automotive comfort control devices.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES
PublisherASME
Pages75-82
Number of pages8
ISBN (Print)0791816508
StatePublished - Dec 1 1999
EventAdvanced Energy Systems Division - 1999 (The ASME International Mechanical Engineering Congress and Exposition) - Nashville, TN, USA
Duration: Nov 14 1999Nov 19 1999

Publication series

NameAmerican Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES
Volume39

Other

OtherAdvanced Energy Systems Division - 1999 (The ASME International Mechanical Engineering Congress and Exposition)
CityNashville, TN, USA
Period11/14/9911/19/99

Fingerprint

Networks (circuits)
Refrigeration
Vapors
Cooling
Fabrication
Microfabrication
Medical applications
Injection molding
Temperature control
Fires
Pumps
Personnel
Composite materials
Polymers
Hot Temperature

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Mechanical Engineering

Cite this

Shannon, M. A., Philpott, M. L., Miller, N. R., Bullard, C. W., Beebe, D. J., Jacobi, A. M., ... Economy, J. (1999). Integrated mesoscopic cooler circuits (IMCCS). In American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES (pp. 75-82). (American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES; Vol. 39). ASME.

Integrated mesoscopic cooler circuits (IMCCS). / Shannon, Mark A.; Philpott, Mike L.; Miller, Norman R.; Bullard, Clark W.; Beebe, David J.; Jacobi, Anthony M; Hrnjak, Predrag Stojan; Saif, M Taher A; Aluru, Narayana R; Sehitoglu, Huseyin; Rockett, Angus; Economy, James.

American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES. ASME, 1999. p. 75-82 (American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES; Vol. 39).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shannon, MA, Philpott, ML, Miller, NR, Bullard, CW, Beebe, DJ, Jacobi, AM, Hrnjak, PS, Saif, MTA, Aluru, NR, Sehitoglu, H, Rockett, A & Economy, J 1999, Integrated mesoscopic cooler circuits (IMCCS). in American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES. American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES, vol. 39, ASME, pp. 75-82, Advanced Energy Systems Division - 1999 (The ASME International Mechanical Engineering Congress and Exposition), Nashville, TN, USA, 11/14/99.
Shannon MA, Philpott ML, Miller NR, Bullard CW, Beebe DJ, Jacobi AM et al. Integrated mesoscopic cooler circuits (IMCCS). In American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES. ASME. 1999. p. 75-82. (American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES).
Shannon, Mark A. ; Philpott, Mike L. ; Miller, Norman R. ; Bullard, Clark W. ; Beebe, David J. ; Jacobi, Anthony M ; Hrnjak, Predrag Stojan ; Saif, M Taher A ; Aluru, Narayana R ; Sehitoglu, Huseyin ; Rockett, Angus ; Economy, James. / Integrated mesoscopic cooler circuits (IMCCS). American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES. ASME, 1999. pp. 75-82 (American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES).
@inproceedings{3de0ea9a5af642449b1bb538e47e83da,
title = "Integrated mesoscopic cooler circuits (IMCCS)",
abstract = "This paper presents the design, fabrication approach, and initial results on the development of an active composite fabric comprising a system of energy-efficient micro-miniature vapor-compression heat pumps to form integrated mesoscopic cooler circuits (IMCCs). Wafer-scale microfabrication, traditional volume processes such as injection molding, and new layered fabrication techniques have been combined with a scale-efficient vapor-compression cycle. The resulting IMCC offers significant improvements in cooling efficiency over normal-scale refrigeration. The flexible polymer-based IMCC patches may be interconnected to form distributed fault-tolerant refrigeration circuits for a wide variety of applications. Potential applications include microclimate control for military, space, and fire fighting personnel, on-board/chip cooling of electronic devices, medical applications requiring highly localized and/or efficient temperature control, and automotive comfort control devices.",
author = "Shannon, {Mark A.} and Philpott, {Mike L.} and Miller, {Norman R.} and Bullard, {Clark W.} and Beebe, {David J.} and Jacobi, {Anthony M} and Hrnjak, {Predrag Stojan} and Saif, {M Taher A} and Aluru, {Narayana R} and Huseyin Sehitoglu and Angus Rockett and James Economy",
year = "1999",
month = "12",
day = "1",
language = "English (US)",
isbn = "0791816508",
series = "American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES",
publisher = "ASME",
pages = "75--82",
booktitle = "American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES",

}

TY - GEN

T1 - Integrated mesoscopic cooler circuits (IMCCS)

AU - Shannon, Mark A.

AU - Philpott, Mike L.

AU - Miller, Norman R.

AU - Bullard, Clark W.

AU - Beebe, David J.

AU - Jacobi, Anthony M

AU - Hrnjak, Predrag Stojan

AU - Saif, M Taher A

AU - Aluru, Narayana R

AU - Sehitoglu, Huseyin

AU - Rockett, Angus

AU - Economy, James

PY - 1999/12/1

Y1 - 1999/12/1

N2 - This paper presents the design, fabrication approach, and initial results on the development of an active composite fabric comprising a system of energy-efficient micro-miniature vapor-compression heat pumps to form integrated mesoscopic cooler circuits (IMCCs). Wafer-scale microfabrication, traditional volume processes such as injection molding, and new layered fabrication techniques have been combined with a scale-efficient vapor-compression cycle. The resulting IMCC offers significant improvements in cooling efficiency over normal-scale refrigeration. The flexible polymer-based IMCC patches may be interconnected to form distributed fault-tolerant refrigeration circuits for a wide variety of applications. Potential applications include microclimate control for military, space, and fire fighting personnel, on-board/chip cooling of electronic devices, medical applications requiring highly localized and/or efficient temperature control, and automotive comfort control devices.

AB - This paper presents the design, fabrication approach, and initial results on the development of an active composite fabric comprising a system of energy-efficient micro-miniature vapor-compression heat pumps to form integrated mesoscopic cooler circuits (IMCCs). Wafer-scale microfabrication, traditional volume processes such as injection molding, and new layered fabrication techniques have been combined with a scale-efficient vapor-compression cycle. The resulting IMCC offers significant improvements in cooling efficiency over normal-scale refrigeration. The flexible polymer-based IMCC patches may be interconnected to form distributed fault-tolerant refrigeration circuits for a wide variety of applications. Potential applications include microclimate control for military, space, and fire fighting personnel, on-board/chip cooling of electronic devices, medical applications requiring highly localized and/or efficient temperature control, and automotive comfort control devices.

UR - http://www.scopus.com/inward/record.url?scp=0033300722&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033300722&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0033300722

SN - 0791816508

T3 - American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES

SP - 75

EP - 82

BT - American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES

PB - ASME

ER -