Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining

X. F. Zhang, H. Y. Liu, J. D. Guo, J. K. Shang

Research output: Contribution to journalArticlepeer-review


Plastic prestraining was applied to a solder interconnect to introduce internal defects such as dislocations in order to investigate the interaction of dislocations with electromigration damage. Above a critical prestrain, Bi interfacial segregation to the anode, a clear indication of electromigration damage in SnBi solder interconnect, was effectively prevented. Such an inhibiting effect is apparently contrary to the common notion that dislocations often act as fast diffusion paths. It is suggested that the dislocations introduced by plastic prestraining acted as sinks for vacancies in the early stage of the electromigration process, but as the vacancies accumulated at the dislocations, climb of those dislocations prompted recovery of the deformed samples under current stressing, greatly decreasing the density of dislocation and vacancy in the solder, leading to slower diffusion of Bi atoms.

Original languageEnglish (US)
Pages (from-to)1072-1076
Number of pages5
JournalJournal of Materials Science and Technology
Issue number11
StatePublished - Nov 2011


  • Dislocation
  • Electromigration
  • Interfacial segregation
  • Prestrain
  • Vacancy

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Polymers and Plastics
  • Metals and Alloys
  • Materials Chemistry


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