TY - JOUR
T1 - Inhibition due to the interaction of polyethylene glycol, chloride, and copper in plating baths
T2 - A surface-enhanced Raman study
AU - Feng, Z. Vivian
AU - Li, Xiao
AU - Gewirth, Andrew A.
PY - 2003/9/4
Y1 - 2003/9/4
N2 - The synergic effect of poly(ethylene glycol) together with chloride ion for inhibiting copper deposition in copper electroplating has been of particular interest for some time. In this study, the potential-dependent behavior of poly(ethylene glycol), with or without chloride ion in a copper electroplating bath is investigated using the surface-enhanced Raman spectroscopy technique. The presence of chloride proves to play a significant role in enhancing PEG adsorption to the Cu electrode surface. More importantly, spectroscopic evidence strongly suggests the formation of a PEG-Cu-Cl complex. By comparing experiment with vibrational modes calculated by using the Hartree-Fock method with a 3-21G* basis set, the structure of this complex is proposed to be a three-coordinated Cu center with two oxygen atoms from PEG and one chloride ligand.
AB - The synergic effect of poly(ethylene glycol) together with chloride ion for inhibiting copper deposition in copper electroplating has been of particular interest for some time. In this study, the potential-dependent behavior of poly(ethylene glycol), with or without chloride ion in a copper electroplating bath is investigated using the surface-enhanced Raman spectroscopy technique. The presence of chloride proves to play a significant role in enhancing PEG adsorption to the Cu electrode surface. More importantly, spectroscopic evidence strongly suggests the formation of a PEG-Cu-Cl complex. By comparing experiment with vibrational modes calculated by using the Hartree-Fock method with a 3-21G* basis set, the structure of this complex is proposed to be a three-coordinated Cu center with two oxygen atoms from PEG and one chloride ligand.
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U2 - 10.1021/jp034875m
DO - 10.1021/jp034875m
M3 - Article
AN - SCOPUS:0141630715
SN - 1520-6106
VL - 107
SP - 9415
EP - 9423
JO - Journal of Physical Chemistry B
JF - Journal of Physical Chemistry B
IS - 35
ER -