Influence of thermal cycling on the thermal resistance of solder interfaces

H. Y. Guo, J. D. Guo, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

The thermal resistance of Si/Sn-52In/Cu sandwiched samples was measured by the laser flash method after various stages of thermal cycling. The thermal resistance was found to increase with increasing thermal cycles after 120 cycles. Cross-sections of the samples were examined by scanning electron microscopy. Cracks were observed in both the solder bulk and the interface between the intermetallic compound and solder. The increase of the thermal resistance was related to widening of the crack segments that were inclined to the interface.

Original languageEnglish (US)
Pages (from-to)2470-2478
Number of pages9
JournalJournal of Electronic Materials
Volume38
Issue number12
DOIs
StatePublished - Dec 2009

Keywords

  • Crack propagation
  • Solder thermal interface materials
  • Thermal cycling
  • Thermal resistance

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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