Abstract
The continual downscaling of silicon devices for integrated circuits requires the formation of transistor (p-n) junctions that are progressively shallower yet incorporate increasing levels of electrically active dopant. In the case of implanted arsenic, the authors show that both goals can be accomplished simultaneously and controllably through the adsorption of small amounts of atomic nitrogen on the Si(100) surface.
Original language | English (US) |
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Article number | 152114 |
Journal | Applied Physics Letters |
Volume | 89 |
Issue number | 15 |
DOIs | |
State | Published - 2006 |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)