TY - GEN
T1 - Influence of post-cure and repeated cycling on thermomechanical characterization of shape memory polymers and composites
AU - McClung, A. J.W.
AU - Tandon, G. P.
AU - Foster, D. C.
AU - Baur, J.
PY - 2010
Y1 - 2010
N2 - For thermally-induced shape memory polymers (SMPs), the shape memory behavior is realized by deforming the material at a temperature above its glass transition temperature (Tg), cooling to a temperature below T g and releasing the deformation for "fixing", and subsequently heating the polymer to a temperature greater than Tg for shape recovery. Thus, the SMP undergoes the temperature change twice across its Tg. These materials display orders of magnitude change in stiffness as they approach and traverse the Tg. In this study, the thermal stability and thermomechanical properties of an epoxy-based SMP resin (Veriflex-E) and its composite laminate (Veritex) were investigated through the use of thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA) under repeated cycling for samples cured with the recommended procedures and those with an additional post-cure of 150 °C for 30 minutes. The SMP resin and composite did show evidence of ongoing curing following the manufacturers recommended cure cycle and that the post-cure significantly improved the thermal stability and thermal repeatability after the first cycle.
AB - For thermally-induced shape memory polymers (SMPs), the shape memory behavior is realized by deforming the material at a temperature above its glass transition temperature (Tg), cooling to a temperature below T g and releasing the deformation for "fixing", and subsequently heating the polymer to a temperature greater than Tg for shape recovery. Thus, the SMP undergoes the temperature change twice across its Tg. These materials display orders of magnitude change in stiffness as they approach and traverse the Tg. In this study, the thermal stability and thermomechanical properties of an epoxy-based SMP resin (Veriflex-E) and its composite laminate (Veritex) were investigated through the use of thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA) under repeated cycling for samples cured with the recommended procedures and those with an additional post-cure of 150 °C for 30 minutes. The SMP resin and composite did show evidence of ongoing curing following the manufacturers recommended cure cycle and that the post-cure significantly improved the thermal stability and thermal repeatability after the first cycle.
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M3 - Conference contribution
AN - SCOPUS:78649486369
SN - 9781934551073
T3 - International SAMPE Symposium and Exhibition (Proceedings)
BT - SAMPE 2010 Conference and Exhibition "New Materials and Processes for a New Economy"
T2 - SAMPE 2010 Conference and Exhibition "New Materials and Processes for a New Economy"
Y2 - 17 May 2010 through 20 May 2010
ER -