Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages

Keyphrases

• Adhesive Failure 100%
• Electronic Packaging 100%
• Initial Porosity 100%
• Porosity Distribution 100%
• Vapor Pressure 40%
• Moisture 40%
• Film-substrate Interface 40%
• Internal Pressure 40%
• Damage Zone 20%
• Void Growth 20%
• Pressure Control 20%
• Thermal Stress 20%
• Material Model 20%
• Catastrophic Failure 20%
• Non-uniformity 20%
• Pressure Effect 20%
• Porous Materials 20%
• Size Scaling 20%
• Void Coalescence 20%
• High Porosity 20%
• Simultaneous Action 20%
• Reflow Soldering 20%
• Gurson 20%
• Extensive Damage 20%
• Low Porosity 20%

Engineering

• Porosity 100%
• Adhesive Failure 100%
• Crack Plane 33%
• Substrate Interface 33%
• Internal Pressure 33%
• Damage Zone 16%
• Thermal Stress 16%
• Material Model 16%
• Void Growth 16%
• Catastrophic Failure 16%
• Nonuniformity 16%
• Size Scale 16%

Material Science

• Film 100%
• Void Growth 50%
• Thermal Stress 50%