Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages

Huck Beng Chew, T. F. Guo, L. Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Adhesives in electronic packages contain numerous pores and cavities of various size-scales. Moisture diffuses into these voids. During reflow soldering, the simultaneous action of thermal stresses and moisture-induced internal pressure drives both pre-existing and newly nucleated voids to grow and coalesce, causing adhesive failure. In this work, a non-uniform initial porosity distribution in the adhesive is assumed. The entire adhesive is modeled by void-containing cells that incorporate vapor pressure effects on void growth and coalescence through an extended Gurson porous material model. Our computations show that increasing non-uniformity in the adhesive's initial porosity shifts the damage zone from the crack plane to sporadic sites between the crack plane and the film-substrate interfaces. For low porosity adhesives with non-uniform initial porosity distribution, internal pressure promotes extensive damage along the film-substrate interfaces. For high porosity adhesives, the combination of vapor pressure and non-uniform initial porosity distribution induces large-scale voiding throughout the adhesive, causing catastrophic failure.

Original languageEnglish (US)
Title of host publicationProceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Pages549-554
Number of pages6
Volume2
StatePublished - 2005
Externally publishedYes
Event7th Electronics Packaging Technology Conference, EPTC 2005 - Singapore, Singapore
Duration: Dec 7 2005Dec 9 2005

Other

Other7th Electronics Packaging Technology Conference, EPTC 2005
CountrySingapore
CitySingapore
Period12/7/0512/9/05

ASJC Scopus subject areas

  • Engineering(all)

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