Influence of microstructure on fatigue crack growth behavior of Sn-Ag solder interfaces

Pi Lin Liu; Jian Ku Shang

doi:10.1007/s11664-000-0056-x

Influence of microstructure on fatigue crack growth behavior of Sn-Ag solder interfaces

Pi Lin Liu, Jian Ku Shang

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

The relationship between microstructure and fatigue crack growth behavior was examined at Sn-Ag solder interfaces on copper and electroless-nickel metallizations. On copper metallization, the solder interface was lined with a coarse Ag₃Sn intermetallic phase in addition to the Cu₆Sn₅ intermetallic and the adjacent solder alloy contained nodular Ag₃Sn phase. This interfacial microstructure was shown to result in inferior fatigue resistance, with the fatigue crack path following the interfacial Ag₃Sn intermetallic phase. In contrast, the solder interface on the electroless-nickel metallization was covered with a thin layer of Ni₃Sn₄ intermetallic phase, and the solder microstructure was composed of fine needles of Ag₃Sn phase dispersed in the Sn-rich matrix. This solder interface was found to be significantly more resistant to fatigue than the copper/Sn-Ag solder interface.

Original language	English (US)
Pages (from-to)	622-627
Number of pages	6
Journal	Journal of Electronic Materials
Volume	29
Issue number	5
DOIs	https://doi.org/10.1007/s11664-000-0056-x
State	Published - May 2000

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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title = "Influence of microstructure on fatigue crack growth behavior of Sn-Ag solder interfaces",

abstract = "The relationship between microstructure and fatigue crack growth behavior was examined at Sn-Ag solder interfaces on copper and electroless-nickel metallizations. On copper metallization, the solder interface was lined with a coarse Ag3Sn intermetallic phase in addition to the Cu6Sn5 intermetallic and the adjacent solder alloy contained nodular Ag3Sn phase. This interfacial microstructure was shown to result in inferior fatigue resistance, with the fatigue crack path following the interfacial Ag3Sn intermetallic phase. In contrast, the solder interface on the electroless-nickel metallization was covered with a thin layer of Ni3Sn4 intermetallic phase, and the solder microstructure was composed of fine needles of Ag3Sn phase dispersed in the Sn-rich matrix. This solder interface was found to be significantly more resistant to fatigue than the copper/Sn-Ag solder interface.",

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AB - The relationship between microstructure and fatigue crack growth behavior was examined at Sn-Ag solder interfaces on copper and electroless-nickel metallizations. On copper metallization, the solder interface was lined with a coarse Ag3Sn intermetallic phase in addition to the Cu6Sn5 intermetallic and the adjacent solder alloy contained nodular Ag3Sn phase. This interfacial microstructure was shown to result in inferior fatigue resistance, with the fatigue crack path following the interfacial Ag3Sn intermetallic phase. In contrast, the solder interface on the electroless-nickel metallization was covered with a thin layer of Ni3Sn4 intermetallic phase, and the solder microstructure was composed of fine needles of Ag3Sn phase dispersed in the Sn-rich matrix. This solder interface was found to be significantly more resistant to fatigue than the copper/Sn-Ag solder interface.

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