Influence of adhesion on micromechanical behavior of SMA composites

K. D. Jonnalagadda, Nancy R. Sottos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Interfacial bond strengths of shape memory alloy wires embedded in a polymer matrix and subject to various surface treatments were estimated using pullout tests. Bond strength data was compared to in-situ wire displacements obtained using heterodyne interferometry. Experimental data shows that sandblasting of wires increases the bond strength while handsanding and acid cleaning actually decrease the bond strength. Plasma coating the wires did not significantly alter the adhesion strength. Comparisons with displacement data show that an increase in bond strength results in a decrease in displacement of the wire.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages143-151
Number of pages9
ISBN (Print)0819417912
StatePublished - Jan 1 1995
EventSmart Structures and Materials 1995: Mathematics and Control in Smart Structures - San Diego, CA, USA
Duration: Feb 27 1995Mar 1 1995

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume2442
ISSN (Print)0277-786X

Other

OtherSmart Structures and Materials 1995: Mathematics and Control in Smart Structures
CitySan Diego, CA, USA
Period2/27/953/1/95

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Influence of adhesion on micromechanical behavior of SMA composites'. Together they form a unique fingerprint.

Cite this