Influence of additives on copper electrodeposition on physical vapor deposited (PVD) copper substrates

Myungchan Kang, Andrew A. Gewirth

Research output: Contribution to journalArticlepeer-review

Abstract

Cross-sectional scanning electron microscopy (SEM), secondary-ion mass spectrometry (SIMS), atomic force microscopy (AFM), and electrochemical measurements are utilized to examine the effect of additives on the morphology and nature of Cu electrodeposited on Cu substrates. The additives used here include 4,5-dithiaoctane-1,8-disulfonic acid (SPS), polyethylene glycol (PEG), and Cl-. SIMS results show that SPS is always included into Cu electrodeposits, while PEG is never included. Cl- is included in deposits only when SPS is present. SEM measurements show that one consequence of this inclusion is the formation of an internal grain structure, which is not evident in the surface morphology measured by AFM alone. The growth of deposits is discussed in terms of cross-sectional and scaling analysis of AFM images.

Original languageEnglish (US)
Pages (from-to)C426-C434
JournalJournal of the Electrochemical Society
Volume150
Issue number6
DOIs
StatePublished - Jul 1 2003

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Influence of additives on copper electrodeposition on physical vapor deposited (PVD) copper substrates'. Together they form a unique fingerprint.

Cite this