In situ TEM study of crack-grain boundary interactions in thin copper foils

Seong Woong Kim; Huck Beng Chew; K. Sharvankumar

doi:10.1016/j.scriptamat.2012.10.009

In situ TEM study of crack-grain boundary interactions in thin copper foils

Seong Woong Kim, Huck Beng Chew, K. Sharvankumar

Aerospace Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

In situ tensile experiments were performed in a transmission electron microscope to investigate the interaction of an advancing crack with grain boundaries in thin copper foils. Cracks propagate within the grains on slip planes due to plastic flow, thinning and overload. Certain grain boundaries are effective in arresting the crack whereas others are not. The stress field of the arrested crack then activates multiple deformation modes in the grain ahead of the crack tip. The observations have significant implications for grain boundary engineering in polycrystalline metal films.

Original language	English (US)
Pages (from-to)	154-157
Number of pages	4
Journal	Scripta Materialia
Volume	68
Issue number	2
DOIs	https://doi.org/10.1016/j.scriptamat.2012.10.009
State	Published - Jan 2013

Keywords

Crack interaction
Grain boundary
Misorientation angle
Thin film
Transmission electron microscopy (TEM)

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Online availability

10.1016/j.scriptamat.2012.10.009

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title = "In situ TEM study of crack-grain boundary interactions in thin copper foils",

abstract = "In situ tensile experiments were performed in a transmission electron microscope to investigate the interaction of an advancing crack with grain boundaries in thin copper foils. Cracks propagate within the grains on slip planes due to plastic flow, thinning and overload. Certain grain boundaries are effective in arresting the crack whereas others are not. The stress field of the arrested crack then activates multiple deformation modes in the grain ahead of the crack tip. The observations have significant implications for grain boundary engineering in polycrystalline metal films.",

keywords = "Crack interaction, Grain boundary, Misorientation angle, Thin film, Transmission electron microscopy (TEM)",

author = "Kim, {Seong Woong} and Chew, {Huck Beng} and K. Sharvankumar",

note = "Funding Information: S.W.K. and S.K. were funded by the National Science Foundation supported Materials Research Science and Engineering Center at Brown University (Micro- and Nano Mechanics of Materials) under award DMR-0520651.H.B.C. was supported by UIUC start-up fund. ",

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doi = "10.1016/j.scriptamat.2012.10.009",

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AU - Chew, Huck Beng

AU - Sharvankumar, K.

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Y1 - 2013/1

N2 - In situ tensile experiments were performed in a transmission electron microscope to investigate the interaction of an advancing crack with grain boundaries in thin copper foils. Cracks propagate within the grains on slip planes due to plastic flow, thinning and overload. Certain grain boundaries are effective in arresting the crack whereas others are not. The stress field of the arrested crack then activates multiple deformation modes in the grain ahead of the crack tip. The observations have significant implications for grain boundary engineering in polycrystalline metal films.

AB - In situ tensile experiments were performed in a transmission electron microscope to investigate the interaction of an advancing crack with grain boundaries in thin copper foils. Cracks propagate within the grains on slip planes due to plastic flow, thinning and overload. Certain grain boundaries are effective in arresting the crack whereas others are not. The stress field of the arrested crack then activates multiple deformation modes in the grain ahead of the crack tip. The observations have significant implications for grain boundary engineering in polycrystalline metal films.

KW - Crack interaction

KW - Grain boundary

KW - Misorientation angle

KW - Thin film

KW - Transmission electron microscopy (TEM)

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In situ TEM study of crack-grain boundary interactions in thin copper foils

Abstract

Keywords

ASJC Scopus subject areas

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