In situ TEM study of crack-grain boundary interactions in thin copper foils

Seong Woong Kim, Huck Beng Chew, K. Sharvankumar

Research output: Contribution to journalArticle

Abstract

In situ tensile experiments were performed in a transmission electron microscope to investigate the interaction of an advancing crack with grain boundaries in thin copper foils. Cracks propagate within the grains on slip planes due to plastic flow, thinning and overload. Certain grain boundaries are effective in arresting the crack whereas others are not. The stress field of the arrested crack then activates multiple deformation modes in the grain ahead of the crack tip. The observations have significant implications for grain boundary engineering in polycrystalline metal films.

Original languageEnglish (US)
Pages (from-to)154-157
Number of pages4
JournalScripta Materialia
Volume68
Issue number2
DOIs
StatePublished - Jan 1 2013

Keywords

  • Crack interaction
  • Grain boundary
  • Misorientation angle
  • Thin film
  • Transmission electron microscopy (TEM)

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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