In situ TEM observations of grain growth in nanograined thin films

K. Hattar, J. Gregg, J. Han, T. Saif, I. M. Robertson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In situ transmission electron microscopy analysis is used to study the stability of nanograined and ultra-fine grained thin films at elevated temperatures. In the free-standing Au and Cu films, grain growth was dependent on annealing temperature and time with growth observed in both materials at temperatures greater than 373K. Both materials exhibited abnormal grain growth although it was more prevalent in Au than in Cu, which may be a consequence of pinning of the Cu grain boundaries by impurities. The formation and destruction of twins was observed to play a critical role in the grain growth, with the twins retarding the growth in gold, but not in Cu. In constrained Au films no grain growth was observed on annealing at temperatures below 636 K. At 636 K, the eutectic temperature, the microstructure transformed to the eutectic structure with the first stage being the annihilation of the grain structure.

Original languageEnglish (US)
Title of host publicationStability of Thin Films and Nanostructures
PublisherMaterials Research Society
Pages101-106
Number of pages6
ISBN (Print)1558998063, 9781558998063
DOIs
StatePublished - Jan 1 2004
Event2004 MRS Fall Meeting - Boston, MA, United States
Duration: Nov 28 2004Dec 3 2004

Publication series

NameMaterials Research Society Symposium Proceedings
Volume854
ISSN (Print)0272-9172

Other

Other2004 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period11/28/0412/3/04

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Hattar, K., Gregg, J., Han, J., Saif, T., & Robertson, I. M. (2004). In situ TEM observations of grain growth in nanograined thin films. In Stability of Thin Films and Nanostructures (pp. 101-106). (Materials Research Society Symposium Proceedings; Vol. 854). Materials Research Society. https://doi.org/10.1557/proc-854-u6.6