Abstract
In situ transmission electron microscopy analysis is used to study the stability of nanograined and ultra-fine grained thin films at elevated temperatures. In the free-standing Au and Cu films, grain growth was dependent on annealing temperature and time with growth observed in both materials at temperatures greater than 373K. Both materials exhibited abnormal grain growth although it was more prevalent in Au than in Cu, which may be a consequence of pinning of the Cu grain boundaries by impurities. The formation and destruction of twins was observed to play a critical role in the grain growth, with the twins retarding the growth in gold, but not in Cu. In constrained Au films no grain growth was observed on annealing at temperatures below 636 K. At 636 K, the eutectic temperature, the microstructure transformed to the eutectic structure with the first stage being the annihilation of the grain structure.
| Original language | English (US) |
|---|---|
| Title of host publication | Stability of Thin Films and Nanostructures |
| Pages | 101-106 |
| Number of pages | 6 |
| State | Published - Dec 1 2004 |
| Event | 2004 MRS Fall Meeting - Boston, MA, United States Duration: Nov 28 2004 → Dec 3 2004 |
Publication series
| Name | Materials Research Society Symposium Proceedings |
|---|---|
| Volume | 854 |
| ISSN (Print) | 0272-9172 |
Other
| Other | 2004 MRS Fall Meeting |
|---|---|
| Country | United States |
| City | Boston, MA |
| Period | 11/28/04 → 12/3/04 |
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ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
In situ TEM observations of grain growth in nanograined thin films. / Hattar, K.; Gregg, J.; Han, J.; Saif, T.; Robertson, I. M.
Stability of Thin Films and Nanostructures. 2004. p. 101-106 (Materials Research Society Symposium Proceedings; Vol. 854).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - In situ TEM observations of grain growth in nanograined thin films
AU - Hattar, K.
AU - Gregg, J.
AU - Han, J.
AU - Saif, T.
AU - Robertson, I. M.
PY - 2004/12/1
Y1 - 2004/12/1
N2 - In situ transmission electron microscopy analysis is used to study the stability of nanograined and ultra-fine grained thin films at elevated temperatures. In the free-standing Au and Cu films, grain growth was dependent on annealing temperature and time with growth observed in both materials at temperatures greater than 373K. Both materials exhibited abnormal grain growth although it was more prevalent in Au than in Cu, which may be a consequence of pinning of the Cu grain boundaries by impurities. The formation and destruction of twins was observed to play a critical role in the grain growth, with the twins retarding the growth in gold, but not in Cu. In constrained Au films no grain growth was observed on annealing at temperatures below 636 K. At 636 K, the eutectic temperature, the microstructure transformed to the eutectic structure with the first stage being the annihilation of the grain structure.
AB - In situ transmission electron microscopy analysis is used to study the stability of nanograined and ultra-fine grained thin films at elevated temperatures. In the free-standing Au and Cu films, grain growth was dependent on annealing temperature and time with growth observed in both materials at temperatures greater than 373K. Both materials exhibited abnormal grain growth although it was more prevalent in Au than in Cu, which may be a consequence of pinning of the Cu grain boundaries by impurities. The formation and destruction of twins was observed to play a critical role in the grain growth, with the twins retarding the growth in gold, but not in Cu. In constrained Au films no grain growth was observed on annealing at temperatures below 636 K. At 636 K, the eutectic temperature, the microstructure transformed to the eutectic structure with the first stage being the annihilation of the grain structure.
UR - http://www.scopus.com/inward/record.url?scp=34249869001&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34249869001&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:34249869001
SN - 1558998063
SN - 9781558998063
T3 - Materials Research Society Symposium Proceedings
SP - 101
EP - 106
BT - Stability of Thin Films and Nanostructures
ER -