In-situ observations of classical grain growth mechanisms during sintering of copper nanoparticles on (001) copper

M. Yeadon; J. C. Yang; R. S. Averback; J. W. Bullard; D. L. Olynick; J. M. Gibson

doi:10.1063/1.120000

In-situ observations of classical grain growth mechanisms during sintering of copper nanoparticles on (001) copper

M. Yeadon, J. C. Yang, R. S. Averback, J. W. Bullard, D. L. Olynick, J. M. Gibson

Research output: Contribution to journal › Article › peer-review

Abstract

The sintering of randomly oriented copper nanoparticles in the size range 4-20 nm with a single crystal (001) copper substrate has been studied in real time using a novel in situ ultrahigh vacuum (UHV) transmission electron microscope. The particles were generated in situ using an UHV DC sputtering attachment and deposited directly onto an electron transparent copper foil inside the microscope. We demonstrate that these particles reorient upon heating to assume the same orientation as the substrate by a classical mechanism involving neck growth and grain boundary motion.

Original language	English (US)
Pages (from-to)	1631-1633
Number of pages	3
Journal	Applied Physics Letters
Volume	71
Issue number	12
DOIs	https://doi.org/10.1063/1.120000
State	Published - Sep 22 1997

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Physics and Astronomy (miscellaneous)

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10.1063/1.120000

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abstract = "The sintering of randomly oriented copper nanoparticles in the size range 4-20 nm with a single crystal (001) copper substrate has been studied in real time using a novel in situ ultrahigh vacuum (UHV) transmission electron microscope. The particles were generated in situ using an UHV DC sputtering attachment and deposited directly onto an electron transparent copper foil inside the microscope. We demonstrate that these particles reorient upon heating to assume the same orientation as the substrate by a classical mechanism involving neck growth and grain boundary motion.",

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AU - Yeadon, M.

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AU - Averback, R. S.

AU - Bullard, J. W.

AU - Olynick, D. L.

AU - Gibson, J. M.

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AB - The sintering of randomly oriented copper nanoparticles in the size range 4-20 nm with a single crystal (001) copper substrate has been studied in real time using a novel in situ ultrahigh vacuum (UHV) transmission electron microscope. The particles were generated in situ using an UHV DC sputtering attachment and deposited directly onto an electron transparent copper foil inside the microscope. We demonstrate that these particles reorient upon heating to assume the same orientation as the substrate by a classical mechanism involving neck growth and grain boundary motion.

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In-situ observations of classical grain growth mechanisms during sintering of copper nanoparticles on (001) copper

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