TY - GEN
T1 - In-situ imaging of RTV silicone pyrolysis
AU - Foster, Collin W.
AU - Oruganti, Sreevishnu
AU - Panerai, Francesco
N1 - Publisher Copyright:
© 2023, American Institute of Aeronautics and Astronautics Inc, AIAA. All rights reserved.
PY - 2023
Y1 - 2023
N2 - Quantitative microstructural analysis of Room Temperature Vulcanized (RTV) silicone pyrolysis at high temperatures is presented. RTV is used as a bonding agent in multiple industries, particularly filling gaps in ablative tiles for hypersonic (re-)entry vehicles and fire prevention. Decomposition of RTV is resolved in real time using in situ high-temperature X-ray computed micro-tomography. Tomographies are acquired every 45 seconds for three different linear heating rates ranging from 13 to 54°C/min. The microstructure is resolved below 5 µm/pixel, allowing for a quantitative analysis of the micro-structural evolution and porous network development. Results are heating rate dependent, and are evaluated for bulk sample volume change, porosity, pore network size, and densification from X-ray attenuation. The outcome of this work is critical to develop multi-physics models for thermal response.
AB - Quantitative microstructural analysis of Room Temperature Vulcanized (RTV) silicone pyrolysis at high temperatures is presented. RTV is used as a bonding agent in multiple industries, particularly filling gaps in ablative tiles for hypersonic (re-)entry vehicles and fire prevention. Decomposition of RTV is resolved in real time using in situ high-temperature X-ray computed micro-tomography. Tomographies are acquired every 45 seconds for three different linear heating rates ranging from 13 to 54°C/min. The microstructure is resolved below 5 µm/pixel, allowing for a quantitative analysis of the micro-structural evolution and porous network development. Results are heating rate dependent, and are evaluated for bulk sample volume change, porosity, pore network size, and densification from X-ray attenuation. The outcome of this work is critical to develop multi-physics models for thermal response.
UR - http://www.scopus.com/inward/record.url?scp=85192183960&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85192183960&partnerID=8YFLogxK
U2 - 10.2514/6.2023-3616
DO - 10.2514/6.2023-3616
M3 - Conference contribution
AN - SCOPUS:85192183960
SN - 9781624107047
T3 - AIAA Aviation and Aeronautics Forum and Exposition, AIAA AVIATION Forum 2023
BT - AIAA Aviation and Aeronautics Forum and Exposition, AIAA AVIATION Forum 2023
PB - American Institute of Aeronautics and Astronautics Inc, AIAA
T2 - AIAA Aviation and Aeronautics Forum and Exposition, AIAA AVIATION Forum 2023
Y2 - 12 June 2023 through 16 June 2023
ER -