Improvement on chip-level electrothermal simulator - ILLIADS-T

Yi Kan Cheng, Elyse Rosenbaum, Sung Mo Kang

Research output: Contribution to journalConference article

Abstract

In this paper, improvements on the previously developed chip-level electrothermal simulator -ILLIADS-T, are presented. The improved version (ILLIADS-T2) enhances the efficiency during uncoupled electrothermal simulations by taking advantage of the potential latency of circuit blocks. The generalized variable-grid system for numerically simulating heat flow in composite materials is also developed and presented.

Original languageEnglish (US)
Pages (from-to)432-435
Number of pages4
JournalProceedings - IEEE International Symposium on Circuits and Systems
Volume4
StatePublished - Jan 1 1996
EventProceedings of the 1996 IEEE International Symposium on Circuits and Systems, ISCAS. Part 1 (of 4) - Atlanta, GA, USA
Duration: May 12 1996May 15 1996

Fingerprint

Simulators
Heat transfer
Networks (circuits)
Composite materials

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Improvement on chip-level electrothermal simulator - ILLIADS-T. / Cheng, Yi Kan; Rosenbaum, Elyse; Kang, Sung Mo.

In: Proceedings - IEEE International Symposium on Circuits and Systems, Vol. 4, 01.01.1996, p. 432-435.

Research output: Contribution to journalConference article

@article{00e107befb504cb1837c325dc1aed4e5,
title = "Improvement on chip-level electrothermal simulator - ILLIADS-T",
abstract = "In this paper, improvements on the previously developed chip-level electrothermal simulator -ILLIADS-T, are presented. The improved version (ILLIADS-T2) enhances the efficiency during uncoupled electrothermal simulations by taking advantage of the potential latency of circuit blocks. The generalized variable-grid system for numerically simulating heat flow in composite materials is also developed and presented.",
author = "Cheng, {Yi Kan} and Elyse Rosenbaum and Kang, {Sung Mo}",
year = "1996",
month = "1",
day = "1",
language = "English (US)",
volume = "4",
pages = "432--435",
journal = "Proceedings - IEEE International Symposium on Circuits and Systems",
issn = "0271-4310",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Improvement on chip-level electrothermal simulator - ILLIADS-T

AU - Cheng, Yi Kan

AU - Rosenbaum, Elyse

AU - Kang, Sung Mo

PY - 1996/1/1

Y1 - 1996/1/1

N2 - In this paper, improvements on the previously developed chip-level electrothermal simulator -ILLIADS-T, are presented. The improved version (ILLIADS-T2) enhances the efficiency during uncoupled electrothermal simulations by taking advantage of the potential latency of circuit blocks. The generalized variable-grid system for numerically simulating heat flow in composite materials is also developed and presented.

AB - In this paper, improvements on the previously developed chip-level electrothermal simulator -ILLIADS-T, are presented. The improved version (ILLIADS-T2) enhances the efficiency during uncoupled electrothermal simulations by taking advantage of the potential latency of circuit blocks. The generalized variable-grid system for numerically simulating heat flow in composite materials is also developed and presented.

UR - http://www.scopus.com/inward/record.url?scp=0029724141&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029724141&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0029724141

VL - 4

SP - 432

EP - 435

JO - Proceedings - IEEE International Symposium on Circuits and Systems

JF - Proceedings - IEEE International Symposium on Circuits and Systems

SN - 0271-4310

ER -