Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects

Rouhollah Mousavi Iraei; Phillip Bonhomme; Nickvash Kani; Sasikanth Manipatruni; Dmitri E. Nikonov; Ian A. Young; Azad Naeemi

doi:10.1109/IITC.2014.6831833

Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects

Rouhollah Mousavi Iraei
, Phillip Bonhomme
, Nickvash Kani
, Sasikanth Manipatruni
, Dmitri E. Nikonov
, Ian A. Young
, Azad Naeemi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The energy-per-bit and delay of All-Spin Logic (ASL) interconnects have been modeled. Both Al and Cu interconnect channels have been considered and the impact of size effects and dimensional scaling on their potential performance has been quantified. It is predicted that size effects will affect ASL interconnects more severely than electrical interconnects.

Original language	English (US)
Title of host publication	2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014
Publisher	IEEE Computer Society
Pages	353-356
Number of pages	4
ISBN (Print)	9781479950164
DOIs	https://doi.org/10.1109/IITC.2014.6831833
State	Published - 2014
Externally published	Yes
Event	2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014 - San Jose, CA, United States Duration: May 20 2014 → May 23 2014

Publication series

Name	2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014

Conference

Conference	2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014
Country/Territory	United States
City	San Jose, CA
Period	5/20/14 → 5/23/14

ASJC Scopus subject areas

Electrical and Electronic Engineering

Online availability

10.1109/IITC.2014.6831833

Library availability

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Iraei, R. M., Bonhomme, P., Kani, N., Manipatruni, S., Nikonov, D. E., Young, I. A., & Naeemi, A. (2014). Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects. In 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014 (pp. 353-356). Article 6831833 (2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014). IEEE Computer Society. https://doi.org/10.1109/IITC.2014.6831833

Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects. / Iraei, Rouhollah Mousavi; Bonhomme, Phillip; Kani, Nickvash et al.
2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014. IEEE Computer Society, 2014. p. 353-356 6831833 (2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Iraei, RM, Bonhomme, P, Kani, N, Manipatruni, S, Nikonov, DE, Young, IA & Naeemi, A 2014, Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects. in 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014., 6831833, 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014, IEEE Computer Society, pp. 353-356, 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014, San Jose, CA, United States, 5/20/14. https://doi.org/10.1109/IITC.2014.6831833

Iraei RM, Bonhomme P, Kani N, Manipatruni S, Nikonov DE, Young IA et al. Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects. In 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014. IEEE Computer Society. 2014. p. 353-356. 6831833. (2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014). doi: 10.1109/IITC.2014.6831833

Iraei, Rouhollah Mousavi ; Bonhomme, Phillip ; Kani, Nickvash et al. / Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects. 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014. IEEE Computer Society, 2014. pp. 353-356 (2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014).

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Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects

Abstract

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